发明授权
US08748316B2 Method of manufacturing semiconductor device, semiconductor device, and camera module
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制造半导体器件，半导体器件和相机模块的方法
- 专利标题： Method of manufacturing semiconductor device, semiconductor device, and camera module
- 专利标题（中）： 制造半导体器件，半导体器件和相机模块的方法
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申请号： US13169548申请日： 2011-06-27
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公开(公告)号： US08748316B2公开(公告)日： 2014-06-10
- 发明人: Takashi Shirono , Mie Matsuo , Hideo Numata , Kazumasa Tanida , Tsuyoshi Matsumura
- 申请人： Takashi Shirono , Mie Matsuo , Hideo Numata , Kazumasa Tanida , Tsuyoshi Matsumura
- 申请人地址： JP Tokyo
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JP Tokyo
- 代理机构： Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- 优先权： JP2010-145886 20100628
- 主分类号： H01L21/302
- IPC分类号： H01L21/302 ; H01L21/461
摘要：
According to an embodiment, a method of manufacturing a semiconductor device includes polishing a peripheral portion of the semiconductor substrate, and forming a protective film to be an insulating film, on a surface of the semiconductor substrate including a surface exposed by the polishing.
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