发明授权
- 专利标题： Soft material wafer bonding and method of bonding
- 专利标题（中）： 软材料晶圆接合和粘合方法
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申请号： US13371198申请日： 2012-02-10
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公开(公告)号： US08748885B2公开(公告)日： 2014-06-10
- 发明人: Tung-Ti Yeh , Chung-Yi Huang , Ya Wen Wu , Hui Mei Jao , Ting-Chun Wang , Shiu-Ko JangJian , Chia-Hung Chung
- 申请人： Tung-Ti Yeh , Chung-Yi Huang , Ya Wen Wu , Hui Mei Jao , Ting-Chun Wang , Shiu-Ko JangJian , Chia-Hung Chung
- 申请人地址： TW
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW
- 代理机构： Lowe Hauptman & Ham, LLP
- 主分类号： H01L29/12
- IPC分类号： H01L29/12
摘要：
A semiconductor device including a first wafer assembly having a first substrate and a first oxide layer over the first substrate. The semiconductor device further includes a second wafer assembly having a second substrate and a second oxide layer over the second substrate. The first oxide layer and the second oxide layer are bonded together by van der Waals bonds or covalent bonds. A method of bonding a first wafer assembly and a second wafer assembly including forming a first oxide layer over a first substrate. The method further includes forming a second oxide layer over a second wafer assembly. The method further includes forming van der Waals bonds or covalent bonds between the first oxide layer and the second oxide layer.
公开/授权文献
- US20130207098A1 SOFT MATERIAL WAFER BONDING AND METHOD OF BONDING 公开/授权日：2013-08-15
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