- 专利标题: Power semiconductor device and a method for forming a semiconductor device
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申请号: US13542737申请日: 2012-07-06
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公开(公告)号: US08748974B2公开(公告)日: 2014-06-10
- 发明人: Anton Mauder , Franz Hirler , Wolfgang Lehnert , Rudolf Berger , Klemens Pruegl , Hans-Joachim Schulze , Helmut Strack
- 申请人: Anton Mauder , Franz Hirler , Wolfgang Lehnert , Rudolf Berger , Klemens Pruegl , Hans-Joachim Schulze , Helmut Strack
- 申请人地址: AT Villach
- 专利权人: Infineon Technologies Austria AG
- 当前专利权人: Infineon Technologies Austria AG
- 当前专利权人地址: AT Villach
- 代理机构: Murphy, Bilak & Homiller, PLLC
- 优先权: DE102011051670 20110708; CN201110208302 20110725
- 主分类号: H01L29/66
- IPC分类号: H01L29/66
摘要:
A power semiconductor device has a semiconductor body which includes an active area and a peripheral area which both define a horizontal main surface of the semiconductor body. The semiconductor body further includes an n-type semiconductor layer, a pn junction and at least one trench. The n-type semiconductor layer is embedded in the semiconductor body and extends to the main surface in the peripheral area. The pn junction is arranged between the n-type semiconductor layer and the main surface in the active area. The at least one trench extends in the peripheral area from the main surface into the n-type semiconductor layer and includes a dielectric layer with fixed negative charges. In the vertical direction, the dielectric layer is arranged both below and above the pn junction. The dielectric layer with fixed negative charges typically has a negative net charge. Further, a method for forming a semiconductor device is provided.
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