发明授权
US08750343B2 Nitride-based semiconductor light-emitting device, nitride-based semiconductor laser device, nitride-based semiconductor light-emitting diode, method of manufacturing the same, and method of forming nitride-based semiconductor layer 有权
基于氮化物的半导体发光器件,氮化物基半导体激光器件,氮化物基半导体发光二极管,其制造方法以及形成氮化物基半导体层的方法

  • 专利标题: Nitride-based semiconductor light-emitting device, nitride-based semiconductor laser device, nitride-based semiconductor light-emitting diode, method of manufacturing the same, and method of forming nitride-based semiconductor layer
  • 专利标题(中): 基于氮化物的半导体发光器件,氮化物基半导体激光器件,氮化物基半导体发光二极管,其制造方法以及形成氮化物基半导体层的方法
  • 申请号: US12680412
    申请日: 2008-09-25
  • 公开(公告)号: US08750343B2
    公开(公告)日: 2014-06-10
  • 发明人: Ryoji HiroyamaYasuto MiyakeYasumitsu KunoYasuyuki BesshoMasayuki Hata
  • 申请人: Ryoji HiroyamaYasuto MiyakeYasumitsu KunoYasuyuki BesshoMasayuki Hata
  • 申请人地址: US CA Mountain View
  • 专利权人: Future Light, LLC
  • 当前专利权人: Future Light, LLC
  • 当前专利权人地址: US CA Mountain View
  • 代理机构: Ditthavong Mori & Steiner, P.C.
  • 优先权: JP2007-253677 20070928; JP2007-289918 20071107; JP2007-331097 20071221; JP2007-338897 20071228
  • 国际申请: PCT/JP2008/067238 WO 20080925
  • 国际公布: WO2009/041462 WO 20090402
  • 主分类号: H01S5/22
  • IPC分类号: H01S5/22 H01S5/323 H01S5/40
Nitride-based semiconductor light-emitting device, nitride-based semiconductor laser device, nitride-based semiconductor light-emitting diode, method of manufacturing the same, and method of forming nitride-based semiconductor layer
摘要:
A nitride-based semiconductor light-emitting device capable of suppressing complication of a manufacturing process and reduction of luminous efficiency is obtained. This nitride-based semiconductor light-emitting device (50) includes a nitride-based semiconductor device layer (23) formed on a main surface of a (1-100) plane of a substrate (21), having a light-emitting layer (26) having a main surface of a (1-100) plane, a facet (50a) formed on an end of a region including the light-emitting layer (26) of the nitride-based semiconductor device layer (23), formed by a (000-1) plane extending in a direction substantially perpendicular to the main surface ((1-100) plane) of the light-emitting layer (26), and a reflection surface (50c) formed on a region opposed to the facet (50a) of the (000-1) plane, formed by a growth surface of the nitride-based semiconductor device layer (23), extending in a direction inclined at an angle θ1 (about) 62° with respect to the facet (50a).
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