Invention Grant
US08753924B2 Grown carbon nanotube die attach structures, articles, devices, and processes for making them
有权
生长碳纳米管管芯附着结构，制品，器件和制造它们的工艺
- Patent Title: Grown carbon nanotube die attach structures, articles, devices, and processes for making them
- Patent Title (中): 生长碳纳米管管芯附着结构，制品，器件和制造它们的工艺
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Application No.: US13414902Application Date: 2012-03-08
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Publication No.: US08753924B2Publication Date: 2014-06-17
- Inventor: James Cooper Wainerdi , Luigi Colombo , John Paul Tellkamp , Robert Reid Doering
- Applicant: James Cooper Wainerdi , Luigi Colombo , John Paul Tellkamp , Robert Reid Doering
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Wade J. Brady, III; Frederick J. Telecky, Jr.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/10
Abstract:
An article of manufacture includes a semiconductor die (110) having an integrated circuit (105) on a first side of the die (110), a diffusion barrier (125) on a second side of the die (110) opposite the first side, a mat of carbon nanotubes (112) rooted to the diffusion barrier (125), a die attach adhesive (115) forming an integral mass with the mat (112) of the carbon nanotubes, and a die pad (120) adhering to the die attach adhesive and (115) and the mat (112) of carbon nanotubes for at least some thermal transfer between the die (110) and the die pad (120) via the carbon nanotubes (112). Other articles, integrated circuit devices, structures, and processes of manufacture, and assembly processes are also disclosed.
Public/Granted literature
- US20130234313A1 GROWN CARBON NANOTUBE DIE ATTACH STRUCTURES, ARTICLES, DEVICES, AND PROCESSES FOR MAKING THEM Public/Granted day:2013-09-12
Information query
IPC分类:
