发明授权
US08753954B2 Semiconductor device having capacitors fixed to support patterns and method for manufacturing the same 有权
具有固定在支撑图案上的电容器的半导体器件及其制造方法

  • 专利标题: Semiconductor device having capacitors fixed to support patterns and method for manufacturing the same
  • 专利标题(中): 具有固定在支撑图案上的电容器的半导体器件及其制造方法
  • 申请号: US13553078
    申请日: 2012-07-19
  • 公开(公告)号: US08753954B2
    公开(公告)日: 2014-06-17
  • 发明人: Sung Min Park
  • 申请人: Sung Min Park
  • 申请人地址: KR Gyeonggi-do
  • 专利权人: Hynix Semiconductor Inc.
  • 当前专利权人: Hynix Semiconductor Inc.
  • 当前专利权人地址: KR Gyeonggi-do
  • 代理机构: Ladas & Parry LLP
  • 优先权: KR10-2008-0030345 20080401
  • 主分类号: H01L21/311
  • IPC分类号: H01L21/311
Semiconductor device having capacitors fixed to support patterns and method for manufacturing the same
摘要:
A semiconductor device containing a cylindrical shaped capacitor and a method for manufacturing the same is presented. The semiconductor device includes a plurality of storage nodes and a support pattern. The plurality of storage nodes is formed over a semiconductor substrate. The support pattern is fixed to adjacent storage nodes in which the support pattern has a flowable insulation layer buried within the support pattern. The buried flowable insulation layer direct contacts adjacent storage nodes.
信息查询
IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件;其他类目中不包括的电固体器件(使用半导体器件的测量入G01;一般电阻器入H01C;磁体、电感器、变压器入H01F;一般电容器入H01G;电解型器件入H01G9/00;电池组、蓄电池入H01M;波导管、谐振器或波导型线路入H01P;线路连接器、汇流器入H01R;受激发射器件入H01S;机电谐振器入H03H;扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R;一般电光源入H05B;印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K;在具有特殊应用的电路中使用的半导体器件见应用相关的小类)
H01L21/00 专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02 .半导体器件或其部件的制造或处理
H01L21/04 ..至少具有一个跃变势垒或表面势垒的器件,例如PN结、耗尽层、载体集结层
H01L21/18 ...器件有由周期表Ⅳ族元素或含有/不含有杂质的AⅢBⅤ族化合物构成的半导体,如掺杂材料
H01L21/30 ....用H01L21/20至H01L21/26各组不包含的方法或设备处理半导体材料的(在半导体材料上制作电极的入H01L21/28)
H01L21/31 .....在半导体材料上形成绝缘层的,例如用于掩膜的或应用光刻技术的(密封层入H01L21/56);以及这些层的后处理;这些层的材料的选择
H01L21/3105 ......后处理
H01L21/311 .......绝缘层的刻蚀
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