发明授权
US08754494B2 Image sensing device including through vias electrically connecting imaging lens unit to image sensors
失效
图像感测装置包括通过将成像透镜单元电连接到图像传感器的通孔
- 专利标题： Image sensing device including through vias electrically connecting imaging lens unit to image sensors
- 专利标题（中）： 图像感测装置包括通过将成像透镜单元电连接到图像传感器的通孔
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申请号： US13234471申请日： 2011-09-16
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公开(公告)号： US08754494B2公开(公告)日： 2014-06-17
- 发明人: Atsuko Kawasaki , Kenichiro Hagiwara , Hirokazu Sekine
- 申请人： Atsuko Kawasaki , Kenichiro Hagiwara , Hirokazu Sekine
- 申请人地址： JP Tokyo
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP2010-211431 20100921
- 主分类号： H01L31/0203
- IPC分类号： H01L31/0203 ; H01L31/0232 ; H01L27/146 ; G03B17/00 ; H04N5/225
摘要：
According to one embodiment, a solid-state image sensing device includes a semiconductor substrate on which a plurality of pixels are arranged, a transparent substrate including a first through via provided in an opening formed in advance to extend through, an adhesive including a second through via connected to the first through via and configured to bond the semiconductor substrate and the transparent substrate while exposing the pixels, and an imaging lens unit arranged on the transparent substrate.
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