Invention Grant
- Patent Title: Impedance matching circuit for matching planar antennas
- Patent Title (中): 用于匹配平面天线的阻抗匹配电路
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Application No.: US13120260Application Date: 2009-10-06
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Publication No.: US08760239B2Publication Date: 2014-06-24
- Inventor: Edgar Schmidhammer
- Applicant: Edgar Schmidhammer
- Applicant Address: US CA San Diego
- Assignee: Qualcomm Technologies, Inc.
- Current Assignee: Qualcomm Technologies, Inc.
- Current Assignee Address: US CA San Diego
- Agency: Smith Risley Tempel Santos LLC
- Priority: DE102008050743 20081008
- International Application: PCT/EP2009/062981 WO 20091006
- International Announcement: WO2010/040752 WO 20100415
- Main IPC: H03H7/38
- IPC: H03H7/38

Abstract:
A circuit includes a signal path having a node between a signal path input and a signal path output. A first inductive element is connected between the signal path input and the node and a first capacitive element whose capacitance is variably adjustable is connected between the node and the signal path output. A second variable-capacitance capacitive element is connected between the signal path input and ground. A second inductive element is connected between the node and ground, and a third inductive element is connected between the signal path output and ground.
Public/Granted literature
- US20110221543A1 Impedance Matching Circuit for Matching Planar Antennas Public/Granted day:2011-09-15
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