Invention Grant
- Patent Title: Bonding structure of metal member and composite-material member
- Patent Title (中): 金属构件和复合材料构件的结合结构
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Application No.: US13460749Application Date: 2012-04-30
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Publication No.: US08763846B2Publication Date: 2014-07-01
- Inventor: Shinsuke Takeuchi , Eiichi Sato
- Applicant: Shinsuke Takeuchi , Eiichi Sato
- Applicant Address: JP Tokyo
- Assignee: Japanese Aerospace Exploration Agency
- Current Assignee: Japanese Aerospace Exploration Agency
- Current Assignee Address: JP Tokyo
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Priority: JP2009-249822 20091030
- Main IPC: F17C1/04
- IPC: F17C1/04 ; F17C1/02 ; F17C1/16
Abstract:
Provided is a bonding structure of a metal member and a composite-material member which comprises a composite-material member and a metal member adhesively bonded to the composite-material member through an adhesive bonding surface therebetween. The metal member has a slit extending along the adhesive bonding surface to form a thin-walled portion between the adhesive bonding surface and the slit.
Public/Granted literature
- US20120325832A1 BONDING STRUCTURE OF METAL MEMBER AND COMPOSITE-MATERIAL MEMBER Public/Granted day:2012-12-27
Information query
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