发明授权
- 专利标题： Thermosetting composition and printed circuit board using the same
- 专利标题（中）： 热固组合物和使用其的印刷电路板
-
申请号： US12621043申请日： 2009-11-18
-
公开(公告)号： US08765012B2公开(公告)日： 2014-07-01
- 发明人: Myung Sup Jung , Chung Kun Cho , Kwang Hee Kim , Kalinina Fedosya , Man Jong Kim , Tae Jun Ok
- 申请人： Myung Sup Jung , Chung Kun Cho , Kwang Hee Kim , Kalinina Fedosya , Man Jong Kim , Tae Jun Ok
- 申请人地址： KR KR KR
- 专利权人： Samsung Electronics Co., Ltd.,Samsung Electro-Mechanics Co., Ltd.,Samsung Fine Chemicals Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.,Samsung Electro-Mechanics Co., Ltd.,Samsung Fine Chemicals Co., Ltd.
- 当前专利权人地址： KR KR KR
- 代理机构： Cantor Colburn LLP
- 优先权： KR10-2008-0114806 20081118; KR10-2009-0042671 20090515; KR10-2009-0105844 20091104
- 主分类号： C09K19/52
- IPC分类号： C09K19/52
摘要：
A thermosetting composition including an organic solvent, a liquid crystalline thermoset oligomer, and either a crosslinking agent or an epoxy resin or both is disclosed. A printed circuit board which includes the thermosetting composition is also disclosed. The printed circuit board is produced by impregnating the thermosetting composition into a reinforcing material.