Invention Grant
- Patent Title: Solid state imaging device, method of manufacturing the same, and imaging apparatus
- Patent Title (中): 固态成像装置及其制造方法以及成像装置
-
Application No.: US13655896Application Date: 2012-10-19
-
Publication No.: US08765515B2Publication Date: 2014-07-01
- Inventor: Yuko Ohgishi
- Applicant: Sony Corporation
- Applicant Address: JP
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP
- Agency: Sheridan Ross P.C.
- Priority: JP2007-259501 20071003
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L31/08
Abstract:
A solid state imaging device including: a plurality of sensor sections formed in a semiconductor substrate in order to convert incident light into an electric signal; a peripheral circuit section formed in the semiconductor substrate so as to be positioned beside the sensor sections; and a layer having negative fixed electric charges that is formed on a light incidence side of the sensor sections in order to form a hole accumulation layer on light receiving surfaces of the sensor sections.
Public/Granted literature
- US20130063636A1 SOLID STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME, AND IMAGING APPARATUS Public/Granted day:2013-03-14
Information query
IPC分类:
