发明授权
- 专利标题： Sealing film and a semiconductor device using the same
- 专利标题（中）： 密封膜和使用其的半导体器件
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申请号： US12299714申请日： 2008-01-24
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公开(公告)号： US08771828B2公开(公告)日： 2014-07-08
- 发明人: Hiroyuki Kawakami , Katsuyasu Niijima , Naoki Tomori , Daichi Takemori , Takuya Imai
- 申请人： Hiroyuki Kawakami , Katsuyasu Niijima , Naoki Tomori , Daichi Takemori , Takuya Imai
- 申请人地址： JP Tokyo
- 专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Antonelli, Terry, Stout & Kraus, LLP.
- 优先权： JPP2007-016891 20070126; JPP2007-109316 20070418
- 国际申请： PCT/JP2008/050978 WO 20080124
- 国际公布： WO2008/090950 WO 20080731
- 主分类号： H01L23/28
- IPC分类号： H01L23/28 ; B32B27/38 ; B32B27/20 ; C08K3/36 ; H01L23/29 ; C08G59/62 ; C08L63/00 ; C08K3/00
摘要：
A sealing film which includes a resin layer having a flow within the range of 150 to 1800 μm at 80° C., or having a resin layer with a viscosity within the range of 10000 to 100000 Pa·s in a B-stage state at 50 to 100° C. in thermosetting viscoelasticity measurement, and containing: (A) both (a1) a high-molecular-weight component including crosslinking functional groups and having a weight-average molecular weight of 100,000 or more and a Tg within the range of −50 to 50° C., and (a2) a thermosetting component including an epoxy resin as a main component, (B) a filler having an average particle size within the range of 1 to 30 μm, and (C) a colorant, as well as a manufacturing method thereof and a semiconductor device using the same.
公开/授权文献
- US20090189300A1 Sealing Film and a Semiconductor Device Using the Same 公开/授权日：2009-07-30