发明授权
- 专利标题： Module that can be used as a plug-in module and as a solder-down module
- 专利标题（中）： 可用作插件模块和焊接模块的模块
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申请号： US12830174申请日： 2010-07-02
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公开(公告)号： US08774734B1公开(公告)日： 2014-07-08
- 发明人: Mark Rich , Dieter Statezni , Michael Green
- 申请人： Mark Rich , Dieter Statezni , Michael Green
- 申请人地址： US CA San Diego
- 专利权人： QUALCOMM Incorporated
- 当前专利权人： QUALCOMM Incorporated
- 当前专利权人地址： US CA San Diego
- 代理机构： Holland & Hart LLP
- 主分类号： H04B1/38
- IPC分类号： H04B1/38 ; H04B1/40
摘要：
A modular device includes a first printed circuit board and a wireless transceiver (e.g., a radio). Electrical connectors (e.g., pads) are located along multiple edges of the first printed circuit board. The electrical connectors are in locations that correspond to a land pattern on a second printed circuit board. Along one edge of the first printed circuit board, the electrical connectors also correspond to electrical connections in a socket. For certification testing, for example, the device can be plugged into a socket. For installation in a host device, the device can be soldered down to the second printed circuit board.
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