Invention Grant
US08775991B2 Interchangeable connection arrays for double-sided DIMM placement
有权
可互换连接阵列，用于双面DIMM放置
- Patent Title: Interchangeable connection arrays for double-sided DIMM placement
- Patent Title (中): 可互换连接阵列，用于双面DIMM放置
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Application No.: US13888627Application Date: 2013-05-07
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Publication No.: US08775991B2Publication Date: 2014-07-08
- Inventor: Michael W. Leddige , Kuljit Singh Bains , John Thomas Sprietsma
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Caven & Aghevli LLC
- Main IPC: G06F17/50
- IPC: G06F17/50
Abstract:
A memory module has an array of connections. The array of connections is arranged in rows and columns such that there are first and second outer columns. Connections in the first and second outer columns can be interchanged to optimize double-side module placement on a substrate. Other embodiments are also disclosed and claimed.
Public/Granted literature
- US20130341790A1 INTERCHANGEABLE CONNECTION ARRAYS FOR DOUBLE-SIDED DIMM PLACEMENT Public/Granted day:2013-12-26
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