发明授权
- 专利标题： Method and apparatus for applying solder to a work piece
- 专利标题（中）： 将焊料施加到工件上的方法和装置
-
申请号： US13032832申请日： 2011-02-23
-
公开(公告)号： US08777087B2公开(公告)日： 2014-07-15
- 发明人: Hilmar Von Campe , Stefan Meyer , Thai Huynh-Minh , Stephan Huber , Silvio Reiff
- 申请人： Hilmar Von Campe , Stefan Meyer , Thai Huynh-Minh , Stephan Huber , Silvio Reiff
- 申请人地址： DE Mainz
- 专利权人： Schott Solar AG
- 当前专利权人： Schott Solar AG
- 当前专利权人地址： DE Mainz
- 代理机构： Ladas & Parry LLP
- 优先权： DE102010000520 20100223
- 主分类号： B23K20/10
- IPC分类号： B23K20/10 ; B23K1/00 ; H01L31/05 ; H01L31/0224 ; B23K3/06 ; B23K1/06
摘要：
The invention concerns a method and an apparatus for the application of solder onto a work piece, wherein the solder is soldered on at a soldering temperature TL and subject to the influence of ultrasound. In order to be able to solder without difficulties the solder onto work pieces that exhibit sensitivity to breakage it is proposed that the solder is heated, is applied to the work piece that is supported in particular in a spring-mounted manner, and is soldered-on subject to the influence of ultrasound.
公开/授权文献
- US20110204126A1 METHOD AND APPARATUS FOR APPLYING SOLDER TO A WORK PIECE 公开/授权日：2011-08-25
信息查询
