摘要:
The invention relates to a method for connecting solder-coated connection leads (3) made of aluminium or an aluminium alloy having a 0.2% yield strength of less than 120 N/mm2 to photovoltaic solar cells (7, 7a, 7b, 7c) which have metallizations on the upper side and the lower side, by a soldering method such as IR soldering, inductive soldering, thermal contact soldering, ultrasonic soldering or hot air soldering. The metallizations of the solar cells can be precoated with solder. A further solder material (2a, 2b) can be arranged between the connection lead (3) and the metallization of the solar cell (7, 7a, 7b, 7c). The solar cells (7, 7a, 7b, 7c) are connected in series with one another by this procedure.
摘要翻译:本发明涉及一种用于将由铝或铝合金制成的焊料涂覆的连接引线(3)的0.2%屈服强度小于120N / mm 2连接到光伏太阳能电池(7,7a,7b,7c)上的方法, 通过IR焊接,感应焊接,热接触焊接,超声波焊接或热风焊接等焊接方法,在上侧和下侧具有金属化。 太阳能电池的金属化可以用焊料预涂。 可以在连接引线(3)和太阳能电池(7,7a,7b,7c)的金属化之间布置另外的焊料材料(2a,2b)。 太阳能电池(7,7a,7b,7c)通过该过程彼此串联连接。
摘要:
A method and a device for introducing solder onto a solar cell is provided. The method and device employ a solder wire introduced in the molten state onto the solar cell under the action of ultrasonic vibrations applied by a sonotrode. Solder is introduced very precisely onto the solar cell, without subjecting the solar cell to undesirably high temperatures, by introducing the solder wire into a gap running between a heating device and the sonotrode, which applies ultrasonic vibrations and melts and flows through the gap onto the solar cell.
摘要:
The invention relates to a method and a device for screening first particles out of a granulate comprised of first and second particles by conveying the granulate along a first screen surface which extends outward from a vibrating device, wherein the first particles have an aspect ratio a1, with a1>3:1, and the dimensions of the second particles allow them to fall through the mesh of the first screen surface. To screen a certain material fraction which differs geometrically from the remainder of the material in terms of at least one dimension out of the granulate, it is proposed that the granulate be conveyed along the screen surface between said surface and a cover which extends along the screen surface, and that the cover should cause the first particles to be aligned with their longitudinal axes extending along the screen surface, wherein the longitudinal extension of each first particle is greater than the mesh width of the screen which forms the first screen surface, and the longitudinal extension of the second particles is equal to or less than the mesh width.
摘要:
The invention relates to a method and a device for screening first particles out of a granulate comprised of first and second particles by conveying the granulate along a first screen surface which extends outward from a vibrating device, wherein the first particles have an aspect ratio a1, with a1>3:1, and the dimensions of the second particles allow them to fall through the mesh of the first screen surface. To screen a certain material fraction which differs geometrically from the remainder of the material in terms of at least one dimension out of the granulate, it is proposed that the granulate be conveyed along the screen surface between said surface and a cover which extends along the screen surface, and that the cover should cause the first particles to be aligned with their longitudinal axes extending along the screen surface, wherein the longitudinal extension of each first particle is greater than the mesh width of the screen which forms the first screen surface, and the longitudinal extension of the second particles is equal to or less than the mesh width.
摘要:
The invention relates to a method for the cohesive connection of a first element (16, 18) to a second element (10), wherein the elements are located one on the other during the connection process and are connected by means of a solder material which is subjected to ultrasonic vibrations during connection by means of a tool (32, 34). In order to allow cohesive connection in an energy-efficient manner, it is proposed that the first element (16, 18) used is one which has through-passage openings (28, 30), that for the purpose of connection the first element and the second element (10) are placed one on the other with through-passage openings open towards the second element, and that molten solder material is located in the through-passage openings during connection and in the through-passage openings the molten solder material is subjected to the ultrasonic vibrations.
摘要:
A method for recovering and/or recycling starting silicon material by crushing the starting material. The recovered or recycled material is melted, and crystals, e.g. as a silicon block, tube, or strip, are grown from the obtained melt. To use starting materials that have a high aspect ratio to be able to convey the same without any problem, broken polycrystalline needle-shaped Si material (material I) containing particles having an aspect ratio AI, 5
摘要:
Method for treating and/or coating a surface of an object, especially for coating a surface of a substrate such as a semiconductor component or solar cell, in which the surface is supplied with a gas that contains particles that will interact and/or react with the surface, forming a coating thereon. The surface of the object is oriented at an angle α from the vertical, and the gas is directed toward the surface such that it flows along the object by force of convection, starting from the base area of the surface of the object.
摘要:
The invention concerns a method and an apparatus for the application of solder onto a work piece, wherein the solder is soldered on at a soldering temperature TL and subject to the influence of ultrasound. In order to be able to solder without difficulties the solder onto work pieces that exhibit sensitivity to breakage it is proposed that the solder is heated, is applied to the work piece that is supported in particular in a spring-mounted manner, and is soldered-on subject to the influence of ultrasound.
摘要:
Method for constructing a line or dotted structure on a support, especially for constructing strip-like electrically conducting contacts on a semiconductor component such as a solar cell, by applying an electrically conducting paste-like substance containing a solvent adhering to a support and subsequent hardening of the substance. After the substance is applied to the support, a medium containing a polar molecule is applied on the support and/or the substance, through which the solvent contained in the substance is extracted.
摘要:
A method for producing a solar cell that has a semiconductor substrate of a first conductivity type. The method includes producing a plurality of passage openings, creating a layer of a conductivity type opposite the first conductivity type along a front side, producing a front-side contact in the form of a metallization and a back-side contact. Electrically conductive front-side contact areas bound the passage openings on the front side and are formed when the front-side contact is formed. The passage openings are provided with an electrically insulating first layer on the inside, and an electrically conductive material is subsequently introduced, starting from a back side, through the passage openings up to the front-side contact areas while back-side contact areas are simultaneously formed.