发明授权
- 专利标题: Deep hole processing device
- 专利标题(中): 深孔加工装置
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申请号: US13045314申请日: 2011-03-10
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公开(公告)号: US08777526B2公开(公告)日: 2014-07-15
- 发明人: Yasuo Nagase , Hiromichi Takahashi , Shigeki Otaka
- 申请人: Yasuo Nagase , Hiromichi Takahashi , Shigeki Otaka
- 申请人地址: JP Tokyo JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba,Toshiba Kikai Kabushiki Kaisha
- 当前专利权人: Kabushiki Kaisha Toshiba,Toshiba Kikai Kabushiki Kaisha
- 当前专利权人地址: JP Tokyo JP Tokyo
- 代理机构: DLA Piper LLP (US)
- 优先权: JP2010-59386 20100316
- 主分类号: B23B39/00
- IPC分类号: B23B39/00 ; B23Q11/10
摘要:
There is provided a deep hole processing device for forming a hole by rotational movement of a main spindle to which a tool is attached of a portal machine toward a workpiece, having, a bush having a hole diameter for guiding rotational movement of the tool, and a bush holding unit provided on a cross rail capable of moving on columns of the portal machine for holding the bush with respect to a spindle head on which the main spindle is mounted at a predetermined distance, wherein a position of the bush relative to the workpiece and a pressure at which the bush is pressed against the workpiece may be controlled by movement of the cross rail.
公开/授权文献
- US20110229280A1 DEEP HOLE PROCESSING DEVICE 公开/授权日:2011-09-22
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