Invention Grant
- Patent Title: Positive resist composition and patterning process
- Patent Title (中): 正抗蚀剂组成和图案化工艺
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Application No.: US13404824Application Date: 2012-02-24
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Publication No.: US08778592B2Publication Date: 2014-07-15
- Inventor: Jun Hatakeyama , Takeshi Nagata , Taku Morisawa
- Applicant: Jun Hatakeyama , Takeshi Nagata , Taku Morisawa
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2011-040065 20110225
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/039 ; G03F7/26
Abstract:
A positive resist composition based on a polymer comprising recurring units of (meth)acrylate having a cyclic acid labile group and a dihydroxynaphthalene novolak resin, and containing a photoacid generator is improved in resolution, step coverage and adhesion on a highly reflective stepped substrate, has high resolution, and forms a pattern of good profile and minimal edge roughness through exposure and development.
Public/Granted literature
- US20120220112A1 POSITIVE RESIST COMPOSITION AND PATTERNING PROCESS Public/Granted day:2012-08-30
Information query
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