Invention Grant
- Patent Title: Open back box with ground screw bump
- Patent Title (中): 打开带有接地螺钉凸起的后箱
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Application No.: US13235112Application Date: 2011-09-16
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Publication No.: US08779284B2Publication Date: 2014-07-15
- Inventor: William Wagner , John Mure , Ryan Crouthamel
- Applicant: William Wagner , John Mure , Ryan Crouthamel
- Applicant Address: US TX Houston
- Assignee: Cooper Technologies Company
- Current Assignee: Cooper Technologies Company
- Current Assignee Address: US TX Houston
- Agency: King & Spalding LLP
- Main IPC: H01J5/00
- IPC: H01J5/00 ; H01J15/00 ; H02G3/08 ; H05K5/00

Abstract:
The disclosure herein provides for an electrical device housing that includes a protrusion, or bump, for securing a electrical ground wire to the housing. The housing may include a plurality of walls defining an interior space for housing the electrical device, including at least one side wall and a back wall orthogonal to the at least one side wall. The back wall may include an opening configured to allow access to the interior space of the housing. A protrusion may extend forward from the back wall into the interior space of the housing, and may include a mounting surface offset from the back wall in a direction toward the interior space of the housing, and a hole formed in the mounting surface for receiving a fastener to secure a ground wire to the housing.
Public/Granted literature
- US20120067612A1 OPEN BACK BOX WITH GROUND SCREW BUMP Public/Granted day:2012-03-22
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