A sensor package is provided having a light sensitive component and a light emitting component attached to a same substrate. Light from the light emitting component is emitted from the package through a first opening and reflected back into the package to the light sensitive component through a second opening in the package. A glass attachment is placed between the light emitting component and the light sensitive component. A portion of the glass is removed and filled with an opaque substance to prevent light travelling between the light emitting component and the light sensitive component in the package.