公开(公告)号：US20190237393A1

公开(公告)日：2019-08-01

申请号：US16380591

申请日：2019-04-10

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Wing Shenq Wong

IPC: H01L23/495 ,  H01L23/00 ,  H01L25/065

Abstract: A single chip integrated circuit (IC) package includes a die pad, and a spacer ring on the die pad defining a solder receiving area. A solder body is on the die pad within the solder receiving area. An IC die is on the spacer ring and is secured to the die pad by the solder body within the solder receiving area. Encapsulating material surrounds the die pad, spacer ring, and IC die. For a multi-chip IC package, a dam structure is on the die pad and defines multiple solder receiving areas. A respective solder body is on the die pad within a respective solder receiving area. An IC die is within each respective solder receiving area and is held in place by a corresponding solder body. Encapsulating material surrounds the die pad, dam structure, and plurality of IC die.

公开(公告)号：US09258467B2

公开(公告)日：2016-02-09

申请号：US14084410

申请日：2013-11-19

Applicant: STMicroelectronics Pte Ltd.

Inventor： Wing Shenq Wong

IPC: H04N3/14 ,  H04N5/335 ,  H04N5/225 ,  H01L27/146 ,  B29L31/00

CPC classification number: H04N5/2253 ,  B29L2031/764 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16195 ,  H04N5/2257 ,  H01L2924/00014

Abstract: One or more embodiments are directed to optical module assemblies, such as a camera module assembly, and methods of forming same. One embodiment is directed to an optical module assembly that includes a substrate having a first surface. An optical device is secured to the first surface of the substrate and electrically coupled to the substrate. A molded body is located on the first surface of the substrate outward of the optical device. The molded body includes a first recess. A lens assembly is secured to the molded body over the first recess by an adhesive material located in the first recess. In some embodiments, the molded body of the optical module assembly further includes a second recess spaced apart from the first recess. A transparent material is secured to the molded body over the second recess by an adhesive material located in the second recess.

Abstract translation: 一个或多个实施例涉及光学模块组件，例如相机模块组件，以及形成它们的方法。 一个实施例涉及包括具有第一表面的基板的光学模块组件。 光学装置被固定到基板的第一表面并电耦合到基板。 成型体位于基板的第一表面上，位于光学装置的外侧。 成型体包括第一凹部。 透镜组件通过位于第一凹部中的粘合剂材料固定到模制主体上方的第一凹部上。 在一些实施例中，光学模块组件的成型体还包括与第一凹部间隔开的第二凹部。 透明材料通过位于第二凹部中的粘合剂材料固定在第二凹部上的成型体上。

公开(公告)号：US20150138436A1

公开(公告)日：2015-05-21

申请号：US14084410

申请日：2013-11-19

Applicant: STMicroelectronics Pte Ltd.

Inventor： Wing Shenq Wong

IPC: H04N5/225 ,  B29D11/00 ,  B29C65/48

CPC classification number: H04N5/2253 ,  B29L2031/764 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16195 ,  H04N5/2257 ,  H01L2924/00014

Abstract: One or more embodiments are directed to optical module assemblies, such as a camera module assembly, and methods of forming same. One embodiment is directed to an optical module assembly that includes a substrate having a first surface. An optical device is secured to the first surface of the substrate and electrically coupled to the substrate. A molded body is located on the first surface of the substrate outward of the optical device. The molded body includes a first recess. A lens assembly is secured to the molded body over the first recess by an adhesive material located in the first recess. In some embodiments, the molded body of the optical module assembly further includes a second recess spaced apart from the first recess. A transparent material is secured to the molded body over the second recess by an adhesive material located in the second recess.

Abstract translation: 一个或多个实施例涉及光学模块组件，例如相机模块组件，以及形成它们的方法。 一个实施例涉及包括具有第一表面的基板的光学模块组件。 光学装置被固定到基板的第一表面并电耦合到基板。 成型体位于基板的第一表面上，位于光学装置的外侧。 成型体包括第一凹部。 透镜组件通过位于第一凹部中的粘合剂材料固定到模制主体上方的第一凹部上。 在一些实施例中，光学模块组件的成型体还包括与第一凹部间隔开的第二凹部。 透明材料通过位于第二凹部中的粘合剂材料固定在第二凹部上的成型体上。

公开(公告)号：US20150001111A1

公开(公告)日：2015-01-01

申请号：US13931313

申请日：2013-06-28

Applicant: STMicroelectronics Pte Ltd.

Inventor： Wing Shenq Wong

IPC: B65D85/38

CPC classification number: H01L27/14683 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/16235 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Embodiments of the present invention are directed to optical packages having a cover made of transparent material with a recess formed therein and methods of forming same. The recess may be formed in a periphery portion of the transparent material and may have various shapes and configurations. Adhesive is provided in at least a portion of the recess of the transparent material, which secures the transparent material to an image sensor.

Abstract translation: 本发明的实施例涉及具有由其中形成有凹部的透明材料制成的盖的光学封装及其形成方法。 凹部可以形成在透明材料的周边部分中，并且可以具有各种形状和构造。 粘合剂设置在透明材料的凹部的至少一部分中，其将透明材料固定到图像传感器。

公开(公告)号：US10297534B2

公开(公告)日：2019-05-21

申请号：US15949541

申请日：2018-04-10

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Wing Shenq Wong

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/495 ,  H01L23/00 ,  H01L25/065 ,  H01L23/31

Abstract: A single chip integrated circuit (IC) package includes a die pad, and a spacer ring on the die pad defining a solder receiving area. A solder body is on the die pad within the solder receiving area. An IC die is on the spacer ring and is secured to the die pad by the solder body within the solder receiving area. Encapsulating material surrounds the die pad, spacer ring, and IC die. For a multi-chip IC package, a dam structure is on the die pad and defines multiple solder receiving areas. A respective solder body is on the die pad within a respective solder receiving area. An IC die is within each respective solder receiving area and is held in place by a corresponding solder body. Encapsulating material surrounds the die pad, dam structure, and plurality of IC die.

公开(公告)号：US09608029B2

公开(公告)日：2017-03-28

申请号：US13931313

申请日：2013-06-28

Applicant: STMicroelectronics Pte Ltd.

Inventor： Wing Shenq Wong

IPC: H01L27/14 ,  H01L31/14 ,  H01L21/00 ,  H01L27/146

CPC classification number: H01L27/14683 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/16235 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Embodiments of the present invention are directed to optical packages having a cover made of transparent material with a recess formed therein and methods of forming same. The recess may be formed in a periphery portion of the transparent material and may have various shapes and configurations. Adhesive is provided in at least a portion of the recess of the transparent material, which secures the transparent material to an image sensor.

公开(公告)号：US09543282B2

公开(公告)日：2017-01-10

申请号：US14083102

申请日：2013-11-18

Applicant: STMicroelectronics Pte Ltd.

Inventor： Wing Shenq Wong

IPC: H01L25/16 ,  H01L23/00

CPC classification number: H01L25/167 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/16151 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to an optical package that includes a stacked arrangement with a plurality of optical devices arranged over an image sensor processor die that is coupled to a first substrate. Between the two optical devices and the image sensor processor die there is provided at least a second substrate. In one embodiment, the optical package is a proximity sensor package and the optical devices include a light-emitting diode die and a light-receiving diode die. In one embodiment, the light-emitting diode die is secured to a surface of the second substrate and the light-receiving diode die is secured to a surface of a third substrate. The second and the third substrate may be secured to a surface of the image sensor processor die or to a surface of encapsulation material.

Abstract translation: 一个或多个实施例涉及用于光学装置的包装系统（SiP），包括接近传感器封装。 一个实施例涉及一种光学封装，其包括具有布置在耦合到第一衬底的图像传感器处理器裸片上的多个光学器件的堆叠布置。 在两个光学器件和图像传感器处理器管芯之间提供至少第二衬底。 在一个实施例中，光学封装是接近传感器封装，并且光学器件包括发光二极管管芯和光接收二极管管芯。 在一个实施例中，发光二极管管芯固定到第二衬底的表面，并且光接收二极管管芯固定到第三衬底的表面。 第二和第三基板可以固定到图像传感器处理器管芯的表面或者封装材料的表面。

公开(公告)号：US20150035133A1

公开(公告)日：2015-02-05

申请号：US13958146

申请日：2013-08-02

Applicant: STMicroelectronics Pte Ltd.

Inventor： Wing Shenq Wong

IPC: H01L23/04 ,  H01L23/00 ,  H01L21/82

CPC classification number: H01L23/04 ,  H01L21/10 ,  H01L21/82 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/96 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/85005 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/16315 ,  H01L2924/16788 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A method is described for making electronic modules includes molding onto a substrate panel a matrix panel defining a plurality of cavities, attaching semiconductor die to the substrate panel in respective cavities of the molded matrix panel, electrically connecting the semiconductor die to the substrate panel, affixing a cover to the molded matrix panel to form an electronic module assembly, mounting the electronic module assembly on a carrier tape, and separating the electronic module assembly into individual electronic modules. An electronic module is described which includes a substrate, a wall member molded onto the substrate, the molded wall member defining a cavity, at least one semiconductor die attached to the substrate in the cavity and electrically connected to the substrate, and a cover affixed to the molded wall member over the cavity.

Abstract translation: 描述了一种用于制造电子模块的方法，包括将限定多个空腔的矩阵面板模制到基板上，将半导体管芯附着到模制矩阵面板的相应空腔中的基板面板，将半导体管芯电连接到基板面板， 模制矩阵面板的盖子以形成电子模块组件，将电子模块组件安装在载带上，以及将电子模块组件分离成各个电子模块。 描述了一种电子模块，其包括衬底，模制在衬底上的壁构件，限定空腔的模制壁构件，至少一个连接到空腔中的衬底并电连接到衬底的半导体管芯，以及固定到 模制的壁构件在空腔上。

公开(公告)号：US10529652B2

公开(公告)日：2020-01-07

申请号：US16380591

申请日：2019-04-10

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Wing Shenq Wong

IPC: H01L23/00 ,  H01L23/495 ,  H01L25/065 ,  H01L23/31

Abstract: A single chip integrated circuit (IC) package includes a die pad, and a spacer ring on the die pad defining a solder receiving area. A solder body is on the die pad within the solder receiving area. An IC die is on the spacer ring and is secured to the die pad by the solder body within the solder receiving area. Encapsulating material surrounds the die pad, spacer ring, and IC die. For a multi-chip IC package, a dam structure is on the die pad and defines multiple solder receiving areas. A respective solder body is on the die pad within a respective solder receiving area. An IC die is within each respective solder receiving area and is held in place by a corresponding solder body. Encapsulating material surrounds the die pad, dam structure, and plurality of IC die.

公开(公告)号：US10061057B2

公开(公告)日：2018-08-28

申请号：US14832971

申请日：2015-08-21

Applicant: STMicroelectronics Pte Ltd ,  STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED

Inventor： Wing Shenq Wong ,  Andy Price ,  Eric Christison

IPC: G06M7/00 ,  G01V8/12 ,  H01L25/16 ,  H01L31/167

CPC classification number: G01V8/12 ,  H01L25/167 ,  H01L31/167 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A method for forming a molded proximity sensor with an optical resin lens and the structure formed thereby. A light sensor chip is placed on a substrate, such as a printed circuit board, and a diode, such as a laser diode, is positioned on top of the light sensor chip and electrically connected to a bonding pad on the light sensor chip. Transparent, optical resin in liquid form is applied as a drop over the light sensor array on the light sensor chip as well as over the light-emitting diode. After the optical resin is cured, a molding compound is applied to an entire assembly, after which the assembly is polished to expose the lenses and have a top surface flush with the top surface of the molding compound.