Invention Grant
US08779551B2 Gated diode structure for eliminating RIE damage from cap removal
失效
门二极管结构,用于消除去除盖子的RIE损坏
- Patent Title: Gated diode structure for eliminating RIE damage from cap removal
- Patent Title (中): 门二极管结构,用于消除去除盖子的RIE损坏
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Application No.: US13489537Application Date: 2012-06-06
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Publication No.: US08779551B2Publication Date: 2014-07-15
- Inventor: Anthony I. Chou , Arvind Kumar , Edward P. Maciejewski , Shreesh Narasimha , Dustin K. Slisher
- Applicant: Anthony I. Chou , Arvind Kumar , Edward P. Maciejewski , Shreesh Narasimha , Dustin K. Slisher
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent H. Daniel Schnurmann
- Main IPC: H01L27/06
- IPC: H01L27/06

Abstract:
A semiconductor structure provided with a plurality of gated-diodes having a silicided anode (p-doped region) and cathode (n-doped region) and a high-K gate stack made of non-silicided gate material, the gated-diodes being adjacent to FETs, each of which having a silicided source, a silicided drain and a silicided HiK gate stack. The semiconductor structure eliminates a cap removal RIE in a gate first High-K metal gate flow from the region of the gated-diode. The lack of silicide and the presence of a nitride barrier on the gate of the diode are preferably made during the gate first process flow. The absence of the cap removal RIE is beneficial in that diffusions of the diode are not subjected to the cap removal RIE, which avoids damage and allows retaining its highly ideal junction characteristics.
Public/Granted literature
- US20130328124A1 GATED DIODE STRUCTURE FOR ELIMINATING RIE DAMAGE FROM CAP REMOVAL Public/Granted day:2013-12-12
Information query
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