Invention Grant
US08779563B2 Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips
有权
具有半导体芯片的工件，半导体器件和用于制造具有半导体芯片的工件的方法
- Patent Title: Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips
- Patent Title (中): 具有半导体芯片的工件，半导体器件和用于制造具有半导体芯片的工件的方法
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Application No.: US13673318Application Date: 2012-11-09
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Publication No.: US08779563B2Publication Date: 2014-07-15
- Inventor: Markus Brunnbauer , Thorsten Meyer , Stephan Brandl , Ralf Plieninger , Jens Pohl , Klaus Pressel , Recai Sezi
- Applicant: Intel Mobile Communications GmbH
- Applicant Address: DE Neubiberg
- Assignee: Intel Mobile Communications GmbH
- Current Assignee: Intel Mobile Communications GmbH
- Current Assignee Address: DE Neubiberg
- Agency: Eschweiler & Associates, LLC
- Priority: DE102007020656 20070430
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/42
Abstract:
A workpiece has at least two semiconductor chips, each semiconductor chip having a first main surface, which is at least partially exposed, and a second main surface. The workpiece also comprises an electrically conducting layer, arranged on the at least two semiconductor chips, the electrically conducting layer being arranged at least on regions of the second main surface, and a molding compound, arranged on the electrically conducting layer.
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