Invention Grant
- Patent Title: Method for inspecting photo-mask
- Patent Title (中): 检查光罩的方法
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Application No.: US13802868Application Date: 2013-03-14
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Publication No.: US08782569B1Publication Date: 2014-07-15
- Inventor: Chain-Ting Huang , Yung-Feng Cheng , Ming-Jui Chen
- Applicant: United Microelectronics Corp.
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: G06F17/50
- IPC: G06F17/50
Abstract:
An inspection method for a photo-mask in a semiconductor process is provided. First, a first photo-mask with a first wafer anchor point (1st wafer FAM) is provided. Then, Dmax and Dmin are calculated according to the 1st wafer FAM. A second photo-mask and a second mask anchor point (2nd mask FAM) of the second photo-mask are provided. A CD average, and a CD range of the second photo-mask are measured. Finally, the second photo-mask is inspected by using equation A and/or equation B: CD average−2nd mask FAM
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