发明授权
- 专利标题: Microneedle array applicator device and method of array application
- 专利标题(中): 微针阵列涂敷装置及阵列应用方法
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申请号: US11993137申请日: 2006-06-23
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公开(公告)号: US08784363B2公开(公告)日: 2014-07-22
- 发明人: Franklyn L. Frederickson , Michael D. Johnson
- 申请人: Franklyn L. Frederickson , Michael D. Johnson
- 申请人地址: US MN St. Paul
- 专利权人: 3M Innovative Properties Company
- 当前专利权人: 3M Innovative Properties Company
- 当前专利权人地址: US MN St. Paul
- 国际申请: PCT/US2006/024671 WO 20060623
- 国际公布: WO2007/002521 WO 20070104
- 主分类号: A61B17/20
- IPC分类号: A61B17/20
摘要:
An applicator device (20) including a housing (22), an impactor (62) for impacting a microneedle array and accelerating the microneedle array toward the target site, wherein the impactor is capable of moving along an arcuate path to move the microneedle array toward the target site. Also, an applicator device including a housing, a patch applicator pivotally supported by the housing, and a torsion spring. The patch applicator has a retaining portion (40) and a patch contacting portion (70), and the patch contacting portion is capable of moving along a substantially arcuate path between a first position and a second position. The torsion spring is capable of biasing the patch applicator relative to the housing.
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