Invention Grant
- Patent Title: Thermosetting composition and printed circuit board using the same
- Patent Title (中): 热固组合物和使用其的印刷电路板
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Application No.: US13048147Application Date: 2011-03-15
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Publication No.: US08784682B2Publication Date: 2014-07-22
- Inventor: Myung-Sup Jung , Jae-Jun Lee
- Applicant: Myung-Sup Jung , Jae-Jun Lee
- Applicant Address: KR KR
- Assignee: Samsung Electro-Mechanics Co., Ltd.,Samsung Fine Chemicals Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.,Samsung Fine Chemicals Co., Ltd.
- Current Assignee Address: KR KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2010-0028179 20100329
- Main IPC: C09K19/38
- IPC: C09K19/38 ; C09K19/52 ; C09K19/30 ; C09K19/32 ; C09K19/34 ; C09K19/12 ; C09K19/20 ; C09K19/54 ; H05K1/00 ; H05K1/16
Abstract:
Disclosed are a thermosetting composition including a liquid crystal oligomer, a bismaleimide-based compound, an epoxy compound, and a fluorinated polymer resin powder. A resin cured product, board, and storage medium each include the thermosetting composition.
Public/Granted literature
- US20110235292A1 THERMOSETTING COMPOSITION AND PRINTED CIRCUIT BOARD USING THE SAME Public/Granted day:2011-09-29
Information query
