Invention Grant
- Patent Title: Self-aligned wafer bonding
- Patent Title (中): 自对准晶片接合
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Application No.: US13913817Application Date: 2013-06-10
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Publication No.: US08784975B2Publication Date: 2014-07-22
- Inventor: Jun Zheng , Dadi Setiadi
- Applicant: Seagate Technology LLC
- Applicant Address: US CA Cupertino
- Assignee: Seagate Technology LLC
- Current Assignee: Seagate Technology LLC
- Current Assignee Address: US CA Cupertino
- Agency: Mueting, Raasch & Gebhardt PA
- Main IPC: B32B3/02
- IPC: B32B3/02
Abstract:
A wafer article includes a substrate, two or more hydrophilic areas disposed on the substrate, hydrophobic areas surrounding the hydrophilic areas, and a eutectic bonding material disposed on the substrate. A wafer apparatus including two wafers having complimentary hydrophilic regions and eutectic bonding material is disclosed and a method of forming a bonded wafer articles is disclosed.
Public/Granted literature
- US20130273328A1 SELF-ALIGNED WAFER BONDING Public/Granted day:2013-10-17
Information query
