发明授权
- 专利标题： Methods of separating solid state transducers from substrates and associated devices and systems
- 专利标题（中）： 将固态传感器与基板和相关设备和系统分离的方法
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申请号： US13482856申请日： 2012-05-29
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公开(公告)号： US08785326B2公开(公告)日： 2014-07-22
- 发明人: Martin F. Schubert , Ming Zhang , Lifang Xu
- 申请人： Martin F. Schubert , Ming Zhang , Lifang Xu
- 申请人地址： US ID Boise
- 专利权人： Micron Technology, Inc.
- 当前专利权人： Micron Technology, Inc.
- 当前专利权人地址： US ID Boise
- 代理机构： Perkins Coie LLP
- 主分类号： H01L21/311
- IPC分类号： H01L21/311
摘要：
Wafer-level processing of wafer assemblies with transducers is described herein. A method in accordance with some embodiments includes forming a solid state transducer device by forming one or more trenches to define solid state radiation transducers. An etching media is delivered in to the trenches to release the transducers from a growth substrate used to fabricate the transducers. A pad can hold the radiation transducers and promote distribution of the etching media through the trenches to underetch and release the transducers.
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