Invention Grant
- Patent Title: Passivation layer surface topography modifications for improved integrity in packaged assemblies
- Patent Title (中): 钝化层表面形貌修改，以提高封装组件的完整性
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Application No.: US13468223Application Date: 2012-05-10
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Publication No.: US08786059B2Publication Date: 2014-07-22
- Inventor: Alexandre Blander , Jon A Casey , Timothy H Daubenspeck , Ian D Melville , Jennifer V Muncy , Marie-Claude Paquet
- Applicant: Alexandre Blander , Jon A Casey , Timothy H Daubenspeck , Ian D Melville , Jennifer V Muncy , Marie-Claude Paquet
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Catherine Ivers; Kevin Anderson
- Main IPC: H01L23/58
- IPC: H01L23/58
Abstract:
A structure and method for producing the same is disclosed. The structure includes an organic passivation layer with solids suspended therein. Preferential etch to remove a portion of the organic material and expose portions of such solids creates enhanced surface roughness, which provides a significant advantage with respect to adhesion of that passivation layer to the packaging underfill material.
Public/Granted literature
- US20120228748A1 PASSIVATION LAYER SURFACE TOPOGRAPHY MODIFICATIONS FOR IMPROVED INTEGRITY IN PACKAGED ASSEMBLIES Public/Granted day:2012-09-13
Information query
IPC分类:
