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公开(公告)号：US08614900B2
公开(公告)日：2013-12-24
申请号：US13110175
申请日：2011-05-18
Applicant: Martin Beaumier , Alexandre Blander , Pascale Gagnon , Michael A. Gaynes , Eric Giguere , Eric Salvas , Luc Tousignant
Inventor： Martin Beaumier , Alexandre Blander , Pascale Gagnon , Michael A. Gaynes , Eric Giguere , Eric Salvas , Luc Tousignant
CPC classification number: H05K9/0009 , H01L23/055 , H01L23/10 , H01L23/552 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/10253 , H01L2924/15311 , H01L2924/16251 , Y10T29/49117 , H01L2924/00 , H01L2224/0401
Abstract: An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface.
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2.发明授权Passivation layer surface topography modifications for improved integrity in packaged assemblies 有权钝化层表面形貌修改，以提高封装组件的完整性公开(公告)号：US08236615B2
公开(公告)日：2012-08-07
申请号：US12625590
申请日：2009-11-25
Applicant: Alexandre Blander , Jon A Casey , Timothy H Daubenspeck , Ian D Melville , Jennifer V Muncy , Marie-Claude Paquet
Inventor： Alexandre Blander , Jon A Casey , Timothy H Daubenspeck , Ian D Melville , Jennifer V Muncy , Marie-Claude Paquet
IPC: H01L21/00
CPC classification number: H01L23/295 , H01L21/563 , H01L23/3142 , H01L2924/0002 , H01L2924/00
Abstract: A structure and method for producing the same is disclosed. The structure includes an organic passivation layer with solids suspended therein. Preferential etch to remove a portion of the organic material and expose portions of such solids creates enhanced surface roughness, which provides a significant advantage with respect to adhesion of that passivation layer to the packaging underfill material.
Abstract translation: 公开了一种其制造方法。 该结构包括具有悬浮在其中的固体的有机钝化层。 优选蚀刻去除一部分有机材料并暴露这些固体的部分产生增强的表面粗糙度，这提供了关于该钝化层与包装底部填充材料的粘附性的显着优点。
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公开(公告)号：US20110292621A1
公开(公告)日：2011-12-01
申请号：US13110175
申请日：2011-05-18
Applicant: Martin Beaumier , Alexandre Blander , Pascale Gagnon , Michael A. Gaynes , Eric Giguere , Eric Salvas , Luc Tousignant
Inventor： Martin Beaumier , Alexandre Blander , Pascale Gagnon , Michael A. Gaynes , Eric Giguere , Eric Salvas , Luc Tousignant
CPC classification number: H05K9/0009 , H01L23/055 , H01L23/10 , H01L23/552 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/10253 , H01L2924/15311 , H01L2924/16251 , Y10T29/49117 , H01L2924/00 , H01L2224/0401
Abstract: An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface.
Abstract translation: 用于在微电子部件级降低EMI的装置包括具有集成在其中的接地导体的基板。 诸如集成电路的微电子部件安装到基板。 导电盖安装到基板上，从而与基板形成物理界面。 导电盖基本覆盖微电子部件。 提供导电链路以在物理接口处在导电盖和接地导体之间产生电连接。
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4.发明授权Passivation layer surface topography modifications for improved integrity in packaged assemblies 有权钝化层表面形貌修改，以提高封装组件的完整性公开(公告)号：US08786059B2
公开(公告)日：2014-07-22
申请号：US13468223
申请日：2012-05-10
Applicant: Alexandre Blander , Jon A Casey , Timothy H Daubenspeck , Ian D Melville , Jennifer V Muncy , Marie-Claude Paquet
Inventor： Alexandre Blander , Jon A Casey , Timothy H Daubenspeck , Ian D Melville , Jennifer V Muncy , Marie-Claude Paquet
IPC: H01L23/58
CPC classification number: H01L23/295 , H01L21/563 , H01L23/3142 , H01L2924/0002 , H01L2924/00
Abstract: A structure and method for producing the same is disclosed. The structure includes an organic passivation layer with solids suspended therein. Preferential etch to remove a portion of the organic material and expose portions of such solids creates enhanced surface roughness, which provides a significant advantage with respect to adhesion of that passivation layer to the packaging underfill material.
Abstract translation: 公开了一种其制造方法。 该结构包括具有悬浮在其中的固体的有机钝化层。 优选蚀刻去除一部分有机材料并暴露这些固体的部分产生增强的表面粗糙度，这提供了关于该钝化层与包装底部填充材料的粘附性的显着优点。
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公开(公告)号：US07512518B2
公开(公告)日：2009-03-31
申请号：US11780064
申请日：2007-07-19
Applicant: Alexandre Blander , Richard Brassard , Carl Savard , Julien Sylvestre
Inventor： Alexandre Blander , Richard Brassard , Carl Savard , Julien Sylvestre
IPC: G06F15/00
CPC classification number: G01B17/02
Abstract: A method of using acoustic signals in the form of waves or pulses to non-destructively measure the thickness of a bonding layer sandwiched between and bonding together overlying and underlying materials different from the bonding layer especially when the thickness of the bonding layer is so small that the features (maxima, minima, time position) of the echo from the interface of the bonding layer and the overlying material is indistinguishable, i.e., not independently observable from the features (maxima, minima, time position) of the echo from the interface of the bonding layer and the underlying material.
Abstract translation: 使用波形或脉冲形式的声信号以非破坏性方式测量不同于接合层的覆盖层和下层材料之间的粘合层的厚度，并且粘结在一起，特别是当粘合层的厚度如此小时，特别是当接合层的厚度如此小时， 来自接合层和覆盖材料的界面的回波的特征（最大值，最小值，时间位置）是不可区分的，即不能独立地从来自接口的界面的特征（最大值，最小值，时间位置）观察到回波 粘合层和下层材料。
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Patent Agency Ranking
公开(公告)号：US20100200271A1
公开(公告)日：2010-08-12
申请号：US12704592
申请日：2010-02-12
Applicant: Charles L. Arvin , Alexandre Blander , Peter J. Brofman , Donald W. Henderson , Gareth G. Hougham , Hsichang Liu , Eric D. Perfecto , Srinivasa S.N. Reddy , Krystyna W. Semkow , Kamalesh K. Srivastava , Brian R. Sundlof , Julien Sylvestre , Renee L. Weisman
Inventor： Charles L. Arvin , Alexandre Blander , Peter J. Brofman , Donald W. Henderson , Gareth G. Hougham , Hsichang Liu , Eric D. Perfecto , Srinivasa S.N. Reddy , Krystyna W. Semkow , Kamalesh K. Srivastava , Brian R. Sundlof , Julien Sylvestre , Renee L. Weisman
CPC classification number: H01B1/02 , B23K35/0244 , B23K35/262 , B23K35/36 , B23K35/3602 , B82Y30/00 , C22C13/00 , H01B13/00 , H01L23/49866 , H01L2924/0002 , H05K3/3436 , H05K3/3463 , H05K2201/0209 , H05K2201/0257 , Y10T29/49117 , H01L2924/00
Abstract: In one embodiment of the present invention, inert nano-sized particles having dimensions from 1 nm to 1,000 nm are added into a solder ball. The inert nano-sized particles may comprise metal oxides, metal nitrides, metal carbides, metal borides, etc. The inert nano-sized particles may be a single compound, or may be a metallic material having a coating of a different material. In another embodiment of the present invention, a small quantity of at least one elemental metal that forms stable high melting intermetallic compound with tin is added to a solder ball. The added at least one elemental metal forms precipitates of intermetallic compounds with tin, which are dispersed as fine particles in the solder.
Abstract translation: 在本发明的一个实施方案中，将尺寸为1nm至1000nm的惰性纳米尺寸颗粒加入到焊球中。 惰性纳米尺寸颗粒可以包括金属氧化物，金属氮化物，金属碳化物，金属硼化物等。惰性纳米尺寸颗粒可以是单一化合物，或者可以是具有不同材料的涂层的金属材料。 在本发明的另一个实施方案中，将少量与锡形成稳定的高熔点金属间化合物的元素金属添加到焊料球中。 添加的至少一种元素金属与锡形成金属间化合物的沉淀物，其作为细颗粒分散在焊料中。
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公开(公告)号：US08493746B2
公开(公告)日：2013-07-23
申请号：US12704592
申请日：2010-02-12
Applicant: Charles L. Arvin , Alexandre Blander , Peter J. Brofman , Donald W. Henderson , Gareth G. Hougham , Hsichang Liu , Eric D. Perfecto , Srinivasa S. N. Reddy , Krystyna W. Semkow , Kamalesh K. Srivastava , Brian R. Sundlof , Julien Sylvestre , Renee L. Weisman
Inventor： Charles L. Arvin , Alexandre Blander , Peter J. Brofman , Donald W. Henderson , Gareth G. Hougham , Hsichang Liu , Eric D. Perfecto , Srinivasa S. N. Reddy , Krystyna W. Semkow , Kamalesh K. Srivastava , Brian R. Sundlof , Julien Sylvestre , Renee L. Weisman
CPC classification number: H01B1/02 , B23K35/0244 , B23K35/262 , B23K35/36 , B23K35/3602 , B82Y30/00 , C22C13/00 , H01B13/00 , H01L23/49866 , H01L2924/0002 , H05K3/3436 , H05K3/3463 , H05K2201/0209 , H05K2201/0257 , Y10T29/49117 , H01L2924/00
Abstract: In one embodiment of the present invention, inert nano-sized particles having dimensions from 1 nm to 1,000 nm are added into a solder ball. The inert nano-sized particles may comprise metal oxides, metal nitrides, metal carbides, metal borides, etc. The inert nano-sized particles may be a single compound, or may be a metallic material having a coating of a different material. In another embodiment of the present invention, a small quantity of at least one elemental metal that forms stable high melting intermetallic compound with tin is added to a solder ball. The added at least one elemental metal forms precipitates of intermetallic compounds with tin, which are dispersed as fine particles in the solder.
Abstract translation: 在本发明的一个实施方案中，将尺寸为1nm至1000nm的惰性纳米尺寸颗粒加入到焊球中。 惰性纳米尺寸颗粒可以包括金属氧化物，金属氮化物，金属碳化物，金属硼化物等。惰性纳米尺寸颗粒可以是单一化合物，或者可以是具有不同材料的涂层的金属材料。 在本发明的另一个实施方案中，将少量与锡形成稳定的高熔点金属间化合物的元素金属添加到焊料球中。 添加的至少一种元素金属与锡形成金属间化合物的沉淀物，其作为细颗粒分散在焊料中。
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8.发明申请PASSIVATION LAYER SURFACE TOPOGRAPHY MODIFICATIONS FOR IMPROVED INTEGRITY IN PACKAGED ASSEMBLIES 有权用于改进包装组合中的完整性的钝化层表面形貌修改公开(公告)号：US20120228748A1
公开(公告)日：2012-09-13
申请号：US13468223
申请日：2012-05-10
Applicant: ALEXANDRE BLANDER , JON A. CASEY , TIMOTHY H. DAUBENSPECK , IAN D. MELVILLE , JENNIFER V. MUNCY , MARIE-CLAUDE PAQUET
Inventor： ALEXANDRE BLANDER , JON A. CASEY , TIMOTHY H. DAUBENSPECK , IAN D. MELVILLE , JENNIFER V. MUNCY , MARIE-CLAUDE PAQUET
IPC: H01L23/58
CPC classification number: H01L23/295 , H01L21/563 , H01L23/3142 , H01L2924/0002 , H01L2924/00
Abstract: A structure and method for producing the same is disclosed. The structure includes an organic passivation layer with solids suspended therein. Preferential etch to remove a portion of the organic material and expose portions of such solids creates enhanced surface roughness, which provides a significant advantage with respect to adhesion of that passivation layer to the packaging underfill material.
Abstract translation: 公开了一种其制造方法。 该结构包括具有悬浮在其中的固体的有机钝化层。 优选蚀刻去除一部分有机材料并暴露这些固体的部分产生增强的表面粗糙度，这提供了关于该钝化层与包装底部填充材料的粘附性的显着优点。
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9.发明申请PASSIVATION LAYER SURFACE TOPOGRAPHY MODIFICATIONS FOR IMPROVED INTEGRITY IN PACKAGED ASSEMBLIES 有权用于改进包装组合中的完整性的钝化层表面形貌修改公开(公告)号：US20110121469A1
公开(公告)日：2011-05-26
申请号：US12625590
申请日：2009-11-25
Applicant: Alexandre Blander , Jon A. Casey , Timothy H. Daubenspeck , Ian D. Melville , Jennifer V. Muncy , Marie-Claude Paquet
Inventor： Alexandre Blander , Jon A. Casey , Timothy H. Daubenspeck , Ian D. Melville , Jennifer V. Muncy , Marie-Claude Paquet
CPC classification number: H01L23/295 , H01L21/563 , H01L23/3142 , H01L2924/0002 , H01L2924/00
Abstract: A structure and method for producing the same is disclosed. The structure includes an organic passivation layer with solids suspended therein. Preferential etch to remove a portion of the organic material and expose portions of such solids creates enhanced surface roughness, which provides a significant advantage with respect to adhesion of that passivation layer to the packaging underfill material.
Abstract translation: 公开了一种其制造方法。 该结构包括具有悬浮在其中的固体的有机钝化层。 优选蚀刻去除一部分有机材料并暴露这些固体的部分产生增强的表面粗糙度，这提供了关于该钝化层与包装底部填充材料的粘附性的显着优点。
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公开(公告)号：US20080021673A1
公开(公告)日：2008-01-24
申请号：US11780064
申请日：2007-07-19
Applicant: Alexandre Blander , Richard Brassard , Carl Savard , Julien Sylvestre
Inventor： Alexandre Blander , Richard Brassard , Carl Savard , Julien Sylvestre
IPC: G01B17/02
CPC classification number: G01B17/02
Abstract: A method of using acoustic signals in the form of waves or pulses to non-destructively measure the thickness of a bonding layer sandwiched between and bonding together overlying and underlying materials different from the bonding layer especially when the thickness of the bonding layer is so small that the features (maxima, minima, time position) of the echo from the interface of the bonding layer and the overlying material is indistinguishable, i.e., not independently observable from the features (maxima, minima, time position) of the echo from the interface of the bonding layer and the underlying material.
Abstract translation: 使用波形或脉冲形式的声信号以非破坏性方式测量不同于接合层的覆盖层和下层材料之间的粘合层的厚度，并且粘结在一起，特别是当粘合层的厚度如此小时，特别是当接合层的厚度如此小时， 来自接合层和覆盖材料的界面的回波的特征（最大值，最小值，时间位置）是不可区分的，即不能独立地从来自接口的界面的特征（最大值，最小值，时间位置）观察到回波 粘合层和下层材料。
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