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发明授权
US08786067B2 Semiconductor package having improved heat spreading performance 有权
具有改善散热性能的半导体封装

Semiconductor package having improved heat spreading performance
摘要：
A semiconductor package having a structure in which heat produced in the interior of the package is effectively spread to the outside of the package is provided. The semiconductor package includes one or more semiconductor chips, one or more substrates (PCBs) having the semiconductor chips respectively attached thereto, a plurality of conductive balls such as a plurality of solder balls to provide voltages and signals to the one or more semiconductor chips, and a heat sink positioned to spread heat produced in the interior of the package to the outside and directly connected to at least one of the plurality of solder balls.
摘要（中）：

提供了一种半导体封装，其具有将封装内部产生的热有效地扩散到封装外部的结构。 半导体封装包括一个或多个半导体芯片，分别具有半导体芯片的一个或多个基板（PCB），多个导电球，例如多个焊球，以向一个或多个半导体芯片提供电压和信号， 以及散热器，定位成将包装内部产生的热量扩散到外部并直接连接到多个焊球中的至少一个。

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