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公开(公告)号：US07973400B2
公开(公告)日：2011-07-05
申请号：US11934635
申请日：2007-11-02
申请人： Soo-Jin Paek , Woo-Seop Kim , Ki-Sung Kim
发明人： Soo-Jin Paek , Woo-Seop Kim , Ki-Sung Kim
IPC分类号： H01L23/373
CPC分类号： H01L25/0657 , H01L23/13 , H01L23/367 , H01L2224/16 , H01L2224/32225 , H01L2224/4824 , H01L2224/73204 , H01L2225/0651 , H01L2225/0652 , H01L2225/06572 , H01L2225/06586 , H01L2225/06589 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H01L2924/15331 , H01L2224/0401
摘要： A semiconductor package having a structure in which heat produced in the interior of the package is effectively spread to the outside of the package is provided. The semiconductor package includes one or more semiconductor chips, one or more substrates (PCBs) having the semiconductor chips respectively attached thereto, a plurality of conductive balls such as a plurality of solder balls to provide voltages and signals to the one or more semiconductor chips, and a heat sink positioned to spread heat produced in the interior of the package to the outside and directly connected to at least one of the plurality of solder balls.
摘要翻译： 提供了一种半导体封装，其具有将封装内部产生的热有效地扩散到封装外部的结构。 半导体封装包括一个或多个半导体芯片，分别具有半导体芯片的一个或多个基板（PCB），多个导电球，例如多个焊球，以向一个或多个半导体芯片提供电压和信号， 以及散热器，定位成将包装内部产生的热量扩散到外部并直接连接到多个焊球中的至少一个。
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公开(公告)号：US20080116557A1
公开(公告)日：2008-05-22
申请号：US11934635
申请日：2007-11-02
申请人： Soo-Jin PAEK , Woo-Seop KIM , Ki-Sung KIM
发明人： Soo-Jin PAEK , Woo-Seop KIM , Ki-Sung KIM
IPC分类号： H01L23/06
CPC分类号： H01L25/0657 , H01L23/13 , H01L23/367 , H01L2224/16 , H01L2224/32225 , H01L2224/4824 , H01L2224/73204 , H01L2225/0651 , H01L2225/0652 , H01L2225/06572 , H01L2225/06586 , H01L2225/06589 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H01L2924/15331 , H01L2224/0401
摘要： A semiconductor package having a structure in which heat produced in the interior of the package is effectively spread to the outside of the package is provided. The semiconductor package includes one or more semiconductor chips, one or more substrates (PCBs) having the semiconductor chips respectively attached thereto,a plurality of conductive balls such as a plurality of solder balls to provide voltages and signals to the one or more semiconductor chips, and a heat sink positioned to spread heat produced in the interior of the package to the outside and directly connected to at least one of the plurality of solder balls.
摘要翻译： 提供了一种半导体封装，其具有将封装内部产生的热有效地扩散到封装外部的结构。 半导体封装包括一个或多个半导体芯片，分别具有半导体芯片的一个或多个基板（PCB），多个导电球，例如多个焊球，以向一个或多个半导体芯片提供电压和信号， 以及散热器，定位成将包装内部产生的热量扩散到外部并直接连接到多个焊球中的至少一个。
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3.发明申请Phase locked loops capable of burn-in testing with increased locking range and burn-in testing method thereof 失效锁相环能够通过增加锁定范围和老化测试方法进行老化测试公开(公告)号：US20080112524A1
公开(公告)日：2008-05-15
申请号：US11822216
申请日：2007-07-03
申请人： Soo-Jin Paek , Jae-wook Lee , Ho-keun Cho
发明人： Soo-Jin Paek , Jae-wook Lee , Ho-keun Cho
IPC分类号： H03D3/24
CPC分类号： H03D13/004 , H03L7/08
摘要： In phase locked loop, a phase detector detects a phase difference between a first clock signal and a second clock signal and output a first output signal based on the detected difference. A charge pump generates a control voltage in response to the first output signal from the phase detector. A voltage-controlled oscillator generates the second clock signal. A controller controls the control voltage such that the phase difference between the first clock signal and the second clock signal is increased in response to a burn-in test mode signal.
摘要翻译： 在锁相环中，相位检测器检测第一时钟信号和第二时钟信号之间的相位差，并基于检测到的差值输出第一输出信号。 电荷泵响应于来自相位检测器的第一输出信号产生控制电压。 压控振荡器产生第二时钟信号。 控制器控制控制电压，使得响应于老化测试模式信号，第一时钟信号和第二时钟信号之间的相位差增加。
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公开(公告)号：US20110193214A1
公开(公告)日：2011-08-11
申请号：US13089120
申请日：2011-04-18
申请人： Soo-Jin Paek , Woo-Seop Kim , Ki-Sung Kim
发明人： Soo-Jin Paek , Woo-Seop Kim , Ki-Sung Kim
IPC分类号： H01L23/12
CPC分类号： H01L25/0657 , H01L23/13 , H01L23/367 , H01L2224/16 , H01L2224/32225 , H01L2224/4824 , H01L2224/73204 , H01L2225/0651 , H01L2225/0652 , H01L2225/06572 , H01L2225/06586 , H01L2225/06589 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H01L2924/15331 , H01L2224/0401
摘要： A semiconductor package having a structure in which heat produced in the interior of the package is effectively spread to the outside of the package is provided. The semiconductor package includes one or more semiconductor chips, one or more substrates (PCBs) having the semiconductor chips respectively attached thereto, a plurality of conductive balls such as a plurality of solder balls to provide voltages and signals to the one or more semiconductor chips, and a heat sink positioned to spread heat produced in the interior of the package to the outside and directly connected to at least one of the plurality of solder balls.
摘要翻译： 提供了一种半导体封装，其具有将封装内部产生的热有效地扩散到封装外部的结构。 半导体封装包括一个或多个半导体芯片，分别具有半导体芯片的一个或多个基板（PCB），多个导电球，例如多个焊球，以向一个或多个半导体芯片提供电压和信号， 以及散热器，定位成将包装内部产生的热量扩散到外部并直接连接到多个焊球中的至少一个。
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公开(公告)号：US08786067B2
公开(公告)日：2014-07-22
申请号：US13089120
申请日：2011-04-18
申请人： Soo-Jin Paek , Woo-Seop Kim , Ki-Sung Kim
发明人： Soo-Jin Paek , Woo-Seop Kim , Ki-Sung Kim
CPC分类号： H01L25/0657 , H01L23/13 , H01L23/367 , H01L2224/16 , H01L2224/32225 , H01L2224/4824 , H01L2224/73204 , H01L2225/0651 , H01L2225/0652 , H01L2225/06572 , H01L2225/06586 , H01L2225/06589 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H01L2924/15331 , H01L2224/0401
摘要： A semiconductor package having a structure in which heat produced in the interior of the package is effectively spread to the outside of the package is provided. The semiconductor package includes one or more semiconductor chips, one or more substrates (PCBs) having the semiconductor chips respectively attached thereto, a plurality of conductive balls such as a plurality of solder balls to provide voltages and signals to the one or more semiconductor chips, and a heat sink positioned to spread heat produced in the interior of the package to the outside and directly connected to at least one of the plurality of solder balls.
摘要翻译： 提供了一种半导体封装，其具有将封装内部产生的热有效地扩散到封装外部的结构。 半导体封装包括一个或多个半导体芯片，分别具有半导体芯片的一个或多个基板（PCB），多个导电球，例如多个焊球，以向一个或多个半导体芯片提供电压和信号， 以及散热器，定位成将包装内部产生的热量扩散到外部并直接连接到多个焊球中的至少一个。
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6.发明授权Phase locked loops capable of burn-in testing with increased locking range and burn-in testing method thereof 失效锁相环能够通过增加锁定范围和老化测试方法进行老化测试公开(公告)号：US07826584B2
公开(公告)日：2010-11-02
申请号：US11822216
申请日：2007-07-03
申请人： Soo-Jin Paek , Jae-wook Lee , Ho-keun Cho
发明人： Soo-Jin Paek , Jae-wook Lee , Ho-keun Cho
CPC分类号： H03D13/004 , H03L7/08
摘要： In phase locked loop, a phase detector detects a phase difference between a first clock signal and a second clock signal and output a first output signal based on the detected difference. A charge pump generates a control voltage in response to the first output signal from the phase detector. A voltage-controlled oscillator generates the second clock signal. A controller controls the control voltage such that the phase difference between the first clock signal and the second clock signal is increased in response to a burn-in test mode signal.
摘要翻译： 在锁相环中，相位检测器检测第一时钟信号和第二时钟信号之间的相位差，并基于检测到的差值输出第一输出信号。 电荷泵响应于来自相位检测器的第一输出信号产生控制电压。 压控振荡器产生第二时钟信号。 控制器控制控制电压，使得响应于老化测试模式信号，第一时钟信号和第二时钟信号之间的相位差增加。
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