Invention Grant
- Patent Title: Stacked device remapping and repair
- Patent Title (中): 堆叠设备重新映射和修复
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Application No.: US13959395Application Date: 2013-08-05
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Publication No.: US08787101B2Publication Date: 2014-07-22
- Inventor: Brent Keeth , Chris G. Martin , Troy A. Manning , Joe M. Jeddeloh , Timothy B. Cowles , Jim Rehmeyer , Paul A. LaBerge
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Main IPC: G11C29/04
- IPC: G11C29/04 ; G11C29/18 ; G06F12/10 ; G06F12/08 ; G06F12/02 ; G11C29/00
Abstract:
Various embodiments include apparatus, systems, and methods having multiple dice arranged in a stack in which a defective cell may be replaced by a spare cell on the same die or a different die. Other embodiments are described.
Public/Granted literature
- US20130329510A1 STACKED DEVICE REMAPPING AND REPAIR Public/Granted day:2013-12-12
Information query
