Invention Grant
- Patent Title: Transceiver and interface for IC package
- Patent Title (中): IC封装的收发器和接口
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Application No.: US13895571Application Date: 2013-05-16
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Publication No.: US08787711B2Publication Date: 2014-07-22
- Inventor: Eric Zbinden , Randall Musser , Jean-Marc André Verdiell , John Mongold , Brian Vicich , Keith Guetig
- Applicant: Samtec, Inc.
- Applicant Address: US IN New Albany
- Assignee: Samtec, Inc.
- Current Assignee: Samtec, Inc.
- Current Assignee Address: US IN New Albany
- Agency: Keating & Bennett, LLP
- Main IPC: G02B6/12
- IPC: G02B6/12 ; H04B1/38 ; H04B10/40 ; G02B6/42

Abstract:
An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
Public/Granted literature
- US20130236186A1 TRANSCEIVER AND INTERFACE FOR IC PACKAGE Public/Granted day:2013-09-12
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