Invention Grant
US08791003B2 Methods for fabricating integrated circuits with fluorine passivation 有权
用氟化钝化制造集成电路的方法

Methods for fabricating integrated circuits with fluorine passivation
Abstract:
Methods for fabricating integrated circuits are provided. In an embodiment, a method for fabricating an integrated circuit includes providing a semiconductor substrate and forming a gate structure on the semiconductor substrate. The gate includes a high-k dielectric material. In the method, a fluorine-containing liquid is contacted with the high-k dielectric material and fluorine is incorporated into the high-k dielectric material.
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