Invention Grant
- Patent Title: Methods for fabricating integrated circuits with fluorine passivation
- Patent Title (中): 用氟化钝化制造集成电路的方法
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Application No.: US13529327Application Date: 2012-06-21
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Publication No.: US08791003B2Publication Date: 2014-07-29
- Inventor: Dina Triyoso , Elke Erben , Robert Binder
- Applicant: Dina Triyoso , Elke Erben , Robert Binder
- Applicant Address: KY Grand Cayman
- Assignee: Globalfoundries, Inc.
- Current Assignee: Globalfoundries, Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Ingrassia Fisher & Lorenz, P.C.
- Main IPC: H01L21/283
- IPC: H01L21/283 ; H01L21/31

Abstract:
Methods for fabricating integrated circuits are provided. In an embodiment, a method for fabricating an integrated circuit includes providing a semiconductor substrate and forming a gate structure on the semiconductor substrate. The gate includes a high-k dielectric material. In the method, a fluorine-containing liquid is contacted with the high-k dielectric material and fluorine is incorporated into the high-k dielectric material.
Public/Granted literature
- US20130344692A1 METHODS FOR FABRICATING INTEGRATED CIRCUITS WITH FLUORINE PASSIVATION Public/Granted day:2013-12-26
Information query
IPC分类: