Invention Grant
- Patent Title: Integrated circuit packaging system with routable circuitry and method of manufacture thereof
- Patent Title (中): 具有可路由电路的集成电路封装系统及其制造方法
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Application No.: US13791375Application Date: 2013-03-08
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Publication No.: US08791556B2Publication Date: 2014-07-29
- Inventor: Byung Tai Do , Arnel Senosa Trasporto , Linda Pei Ee Chua
- Applicant: STATS ChipPAC Ltd.
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L23/28
- IPC: H01L23/28 ; H01L21/56
Abstract:
An integrated circuit packaging system, and a method of manufacture therefor, including: electrical terminals; circuitry protective material around the electrical terminals and formed to have recessed pad volumes; routable circuitry on the top surface of the circuitry protective material; and an integrated circuit die electrically connected to the electrical terminals.
Public/Granted literature
- US20130256861A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ROUTABLE CIRCUITRY AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2013-10-03
Information query
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