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US08792035B2 Solid-state imaging device and manufacturing method thereof, driving method of solid-state imaging device, and electronic equipment 有权
固态成像装置及其制造方法，固态成像装置的驱动方法和电子设备

  • Patent Title: Solid-state imaging device and manufacturing method thereof, driving method of solid-state imaging device, and electronic equipment
  • Patent Title (中): 固态成像装置及其制造方法，固态成像装置的驱动方法和电子设备
  • Application No.: US13011522
    Application Date: 2011-01-21
  • Publication No.: US08792035B2
    Publication Date: 2014-07-29
  • Inventor: Akihiro Yamada
  • Applicant: Akihiro Yamada
  • Applicant Address: JP
  • Assignee: Sony Corporation
  • Current Assignee: Sony Corporation
  • Current Assignee Address: JP
  • Agency: Sheridan Ross P.C.
  • Priority: JP2010-019598 20100129
  • Main IPC: H04N3/14
  • IPC: H04N3/14 ;  H01L31/062 ;  H01L27/146
Solid-state imaging device and manufacturing method thereof, driving method of solid-state imaging device, and electronic equipment
Abstract:
A solid-state imaging device includes multiple pixels formed of photoelectric converters and pixel transistors; a floating diffusion portion that exists within a region of each of the photoelectric converters when viewed from above; and a vertical transfer gate electrode of a transfer transistor that surrounds at least a portion of each photoelectric converter and is formed in the depth direction of a substrate and makes up the pixel transistor.
Abstract(Chinese):

固态成像装置包括由光电转换器和像素晶体管形成的多个像素; 当从上方观察时，存在于每个光电转换器的区域内的浮动扩散部分; 以及转移晶体管的垂直传输栅电极，其围绕每个光电转换器的至少一部分并且在衬底的深度方向上形成并构成像素晶体管。

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