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发明授权
US08792241B2 Assembly of an electronic device casing, a heat-dissipating module and a waterproofing module, and the waterproofing module 有权
电子装置壳体，散热模块和防水模块的组装以及防水模块

Assembly of an electronic device casing, a heat-dissipating module and a waterproofing module, and the waterproofing module
摘要：
An assembly includes an electronic device casing, a heat-dissipating module and a waterproofing module. The electronic device casing is formed with an encircling wall. The encircling wall has a wall body and an apertured portion formed in the wall body. The heat-dissipating module is coupled to the electronic device casing, is surrounded by the encircling wall, and includes a heat pipe extending through the apertured portion. The waterproofing module includes a waterproofing element that has a ring portion disposed on a top rim of the wall body, and a sleeve portion having a first sleeve segment that is connected to the ring portion, that is sleeved on the heat pipe and that engages the apertured portion so as to establish water tightness between the heat pipe and the apertured portion.
摘要（中）：

组件包括电子设备外壳，散热模块和防水模块。 电子设备外壳形成有环绕壁。 环绕的壁具有壁体和形成在壁体中的有孔部分。 散热模块耦合到电子设备壳体，被环绕的壁围绕，并且包括延伸穿过有孔部分的热管。 防水模块包括防水元件，其具有设置在壁体的顶部边缘上的环形部分，以及套筒部分，其具有连接到环形部分上的第一套筒部分，套筒部分套在热管上并且接合 开口部分，以便在热管和有孔部分之间建立水密性。

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