Invention Grant
- Patent Title: Electronic device with locking assembly
- Patent Title (中): 带锁定装置的电子设备
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Application No.: US13223260Application Date: 2011-08-31
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Publication No.: US08792251B2Publication Date: 2014-07-29
- Inventor: Cheng-Feng Shih
- Applicant: Cheng-Feng Shih
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Main IPC: H05K7/02
- IPC: H05K7/02

Abstract:
An electronic device includes an enclosure and a locking assembly. The locking assembly includes a fixing sleeve including a fixing end hermetically fixed to the enclosure, and an opening end away from the enclosure, and a locking bracket. The locking bracket is attached to the fixing sleeve and defines a through hole defining a passing portion and at least one locking portion communicating with each other. The electronic device is position to a fastener by the fastener passing through the passing portion and being positioned in the locking portion of the through hole.
Public/Granted literature
- US20120327628A1 ELECTRONIC DEVICE WITH LOCKING ASSEMBLY Public/Granted day:2012-12-27
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