Invention Grant
- Patent Title: Mold system for forming multilevel blocks
- Patent Title (中): 用于形成多层块的模具系统
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Application No.: US13742968Application Date: 2013-01-16
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Publication No.: US08794956B2Publication Date: 2014-08-05
- Inventor: Paul Adam
- Applicant: Paul Adam
- Agent David H. Chervitz
- Main IPC: B28B3/08
- IPC: B28B3/08 ; B28B7/24 ; B29C43/34 ; E01C5/02 ; A01G1/08
Abstract:
A mold system for forming a multilevel block is disclosed which comprises a multilevel mold box insert for forming a multilevel block, a mold box frame adapted for receiving therein the multilevel mold box insert, a multilevel plunger assembly, and a press head plate adapted for receiving thereon the multilevel plunger assembly.
Public/Granted literature
- US20130129853A1 MOLD SYSTEM FOR FORMING MULTILEVEL BLOCKS Public/Granted day:2013-05-23
Information query
