Mold system for forming multilevel blocks
    2.
    发明授权
    Mold system for forming multilevel blocks 有权
    用于形成多层块的模具系统

    公开(公告)号:US08956139B2

    公开(公告)日:2015-02-17

    申请号:US14318048

    申请日:2014-06-27

    Applicant: Paul Adam

    Inventor: Paul Adam

    CPC classification number: B28B3/083 A01G9/28 B28B3/06 B28B7/0097 B28B7/24

    Abstract: A mold system for forming a multilevel block is disclosed which comprises a multilevel mold box insert for forming a multilevel block, a mold box frame adapted for receiving therein the multilevel mold box insert, a multilevel plunger assembly, and a press head plate adapted for receiving thereon the multilevel plunger assembly.

    Abstract translation: 公开了一种用于形成多级块的模具系统,其包括用于形成多级块的多级模具盒插入件,适于在其中容纳多级模具盒插入件的多个模具箱框架,多级柱塞组件和适于接收 在其上的多级柱塞组件。

    Modular block system
    3.
    发明申请
    Modular block system 有权
    模块化系统

    公开(公告)号:US20060117697A1

    公开(公告)日:2006-06-08

    申请号:US10994859

    申请日:2004-11-22

    Applicant: Paul Adam

    Inventor: Paul Adam

    Abstract: A modular block system comprises a first block, a second block, a third block, a fourth block, and a capstone, the first block having a front face, a back face, a first side, a second side, a top, and a bottom, with the front face being wider than the back face and the first side being slanted from the front face toward the back face, the second block having a front face, a back face, a first side, a second side, a top, and a bottom, with the front face being wider than the back face and the first and second sides being slanted from the front face toward the back face, the third block having a front face, a back face, a first side, a second side, a top, and a bottom, with the front face being wider than the back face and the first side being slanted from the front face toward the back face, and the fourth block having a front face, a back face, a first side, a second side, a top, and a bottom, with the front face being wider than the back face and the first side and the second side being from the front face toward the back face.

    Abstract translation: 模块化块系统包括第一块,第二块,第三块,第四块和盖石,第一块具有正面,背面,第一侧,第二侧,顶部和顶部 底部,其前表面比后表面宽,并且第一侧面从前表面向后表面倾斜,第二块具有正面,背面,第一面,第二面,顶部, 和底部,其前表面比后表面宽,并且第一和第二侧面从前表面向后表面倾斜,第三块具有前表面,后表面,第一侧,第二侧 顶部和底部,其前表面比后表面宽,并且第一侧面从前表面向后表面倾斜,并且第四块具有前表面,后表面,第一侧面, 第二面,顶部和底部,前表面比背面宽,第一面和第二面bei 从前面朝向背面。

    Anti-IGF antibodies
    4.
    发明授权
    Anti-IGF antibodies 有权
    抗IGF抗体

    公开(公告)号:US08580254B2

    公开(公告)日:2013-11-12

    申请号:US12665373

    申请日:2008-06-19

    Abstract: Antibody molecules, in particular fully human antibodies that bind to human IGF-1 and cross-react with IGF-2 such that binding of IGF-1 and IGF-2 to the IGF-1 receptor is prevented and IGF-1 receptor-mediated signaling is inhibited. The antibodies do not bind to insulin and thus do not affect the mitogenic properties of insulin that are mediated by its binding to the insulin receptors. The antibodies are useful for the treatment of hyperproliferative diseases, in particular cancer.

    Abstract translation: 抗体分子,特别是与人IGF-1结合并与IGF-2交叉反应的完全人类抗体,使得IGF-1和IGF-2与IGF-1受体的结合被阻止,并且IGF-1受体介导的信号传导 被抑制。 抗体不结合胰岛素,因此不影响胰岛素与胰岛素受体结合介导的促有丝分裂特性。 抗体可用于治疗过度增生性疾病,特别是癌症。

    Paver stone
    6.
    外观设计
    Paver stone 有权
    摊铺石

    公开(公告)号:USD546478S1

    公开(公告)日:2007-07-10

    申请号:US29254355

    申请日:2006-02-22

    Applicant: Paul Adam

    Designer: Paul Adam

    Interlocking paver stone system
    7.
    发明申请
    Interlocking paver stone system 审中-公开
    联锁摊铺机石系统

    公开(公告)号:US20060233610A1

    公开(公告)日:2006-10-19

    申请号:US11104837

    申请日:2005-04-13

    Applicant: Paul Adam

    Inventor: Paul Adam

    CPC classification number: E01C5/06 E01C2201/06

    Abstract: An interlocking paver stone system comprises a first paver stone having a generally oval configuration and a second paver stone having a generally star configuration having a first point, a second point, a third point, a fourth point, a first curved side between the first point and the second point, a second curved side between the second point and the third point, a third curved side between the third point and the fourth point, and a fourth curved side between the fourth point and the first point.

    Abstract translation: 一种互锁摊铺机石系统,包括具有大致椭圆形构造的第一摊铺机石头和具有通常具有第一点,第二点,第三点,第四点,第一点 第二点,第二点和第三点之间的第二弯曲侧,第三点与第四点之间的第三弯曲侧,第四点与第一点之间的第四弯曲侧。

    MOLD SYSTEM FOR FORMING MULTILEVEL BLOCKS
    8.
    发明申请
    MOLD SYSTEM FOR FORMING MULTILEVEL BLOCKS 有权
    用于形成多块块的模具系统

    公开(公告)号:US20140308383A1

    公开(公告)日:2014-10-16

    申请号:US14318048

    申请日:2014-06-27

    Applicant: Paul Adam

    Inventor: Paul Adam

    CPC classification number: B28B3/083 A01G9/28 B28B3/06 B28B7/0097 B28B7/24

    Abstract: A mold system for forming a multilevel block is disclosed which comprises a multilevel mold box insert for forming a multilevel block, a mold box frame adapted for receiving therein the multilevel mold box insert, a multilevel plunger assembly, and a press head plate adapted for receiving thereon the multilevel plunger assembly.

    Abstract translation: 公开了一种用于形成多级块的模具系统,其包括用于形成多级块的多级模具盒插入件,适于在其中容纳多级模具盒插入件的多个模具箱框架,多级柱塞组件和适于接收 在其上的多级柱塞组件。

    MOLD SYSTEM FOR FORMING MULTILEVEL BLOCKS
    9.
    发明申请
    MOLD SYSTEM FOR FORMING MULTILEVEL BLOCKS 有权
    用于形成多块块的模具系统

    公开(公告)号:US20130129853A1

    公开(公告)日:2013-05-23

    申请号:US13742968

    申请日:2013-01-16

    Applicant: Paul Adam

    Inventor: Paul Adam

    CPC classification number: B28B3/083 A01G9/28 B28B3/06 B28B7/0097 B28B7/24

    Abstract: A mold system for forming a multilevel block is disclosed which comprises a multilevel mold box insert for forming a multilevel block, a mold box frame adapted for receiving therein the multilevel mold box insert, a multilevel plunger assembly, and a press head plate adapted for receiving thereon the multilevel plunger assembly.

    Abstract translation: 公开了一种用于形成多级块的模具系统,其包括用于形成多级块的多级模具盒插入件,适于在其中容纳多级模具盒插入件的多个模具箱框架,多级柱塞组件和适于接收 在其上的多级柱塞组件。

    Capacitive proximity and/or contact sensor and electrically conductive plastic body for such a sensor
    10.
    发明授权
    Capacitive proximity and/or contact sensor and electrically conductive plastic body for such a sensor 有权
    用于这种传感器的电容接近和/或接触传感器和导电塑料体

    公开(公告)号:US07525062B2

    公开(公告)日:2009-04-28

    申请号:US11119257

    申请日:2005-04-29

    CPC classification number: H03K17/962 H03K2217/96076

    Abstract: A capacitive proximity and/or contact sensor has an electrically conductive plastic body, which is disposed between an electrically insulating cover plate and an electrically conductive contact surface of a carrier plate disposed at a distance therefrom. The contact surface can be connected to a gating circuit, through which a change in a capacitance of a condenser formed by the cover plate, the plastic body and the contact surface as a result of proximity and/or contact of a contact region of the cover plate by an element, having a potential different to the potential of the contact surface, can be ascertained and evaluated. The plastic body is configured as a plug-in and/or clamp part and by plugging-in or clipping on the or by clamping on the carrier plate is connected form lockingly and/or force lockingly to the latter and thus to the contact surface.

    Abstract translation: 电容式接近和/或接触传感器具有导电塑料本体,其设置在电绝缘盖板和与其隔开一定距离处的承载板的导电接触表面之间。 接触表面可以连接到门控电路,由盖板,塑料体和接触表面形成的电容器的电容变化由于盖子的接触区域的接近和/或接触而导致 可以确定和评价具有与接触表面的电位不同的电位的元件。 塑料体被构造成插入和/或夹持部分,并且通过在承载板上或通过夹紧在承载板上进行插入或夹紧,从而锁定地和/或锁定地连接到后者并因此连接到接触表面。

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