Invention Grant
- Patent Title: Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
- Patent Title (中): 电镀液中电解质流体动力学的有效传质控制
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Application No.: US13172642Application Date: 2011-06-29
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Publication No.: US08795480B2Publication Date: 2014-08-05
- Inventor: Steven T. Mayer , David W. Porter
- Applicant: Steven T. Mayer , David W. Porter
- Applicant Address: US CA Fremont
- Assignee: Novellus Systems, Inc.
- Current Assignee: Novellus Systems, Inc.
- Current Assignee Address: US CA Fremont
- Agency: Weaver Austin Villeneuve & Sampson LLP
- Main IPC: C25D17/00
- IPC: C25D17/00 ; C25D7/12 ; C25D21/10

Abstract:
Described are apparatus and methods for electroplating one or more metals onto a substrate. Embodiments include electroplating apparatus configured for, and methods including, efficient mass transfer during plating so that highly uniform plating layers are obtained. In specific embodiments, the mass transfer is achieved using a combination of impinging flow and shear flow at the wafer surface.
Public/Granted literature
- US20120000786A1 CONTROL OF ELECTROLYTE HYDRODYNAMICS FOR EFFICIENT MASS TRANSFER DURING ELECTROPLATING Public/Granted day:2012-01-05
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