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US08795480B2 Control of electrolyte hydrodynamics for efficient mass transfer during electroplating 有权
电镀液中电解质流体动力学的有效传质控制

Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
Abstract:
Described are apparatus and methods for electroplating one or more metals onto a substrate. Embodiments include electroplating apparatus configured for, and methods including, efficient mass transfer during plating so that highly uniform plating layers are obtained. In specific embodiments, the mass transfer is achieved using a combination of impinging flow and shear flow at the wafer surface.
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