发明授权
- 专利标题： Conditioner for electroless plating
- 专利标题（中）： 无电镀护发素
-
申请号： US12590056申请日： 2009-11-02
-
公开(公告)号： US08796374B2公开(公告)日： 2014-08-05
- 发明人: Katsuhiro Yoshida
- 申请人： Katsuhiro Yoshida
- 申请人地址： US MA Marlborough
- 专利权人： Rohm and Haas Electronic Materials LLC
- 当前专利权人： Rohm and Haas Electronic Materials LLC
- 当前专利权人地址： US MA Marlborough
- 代理商 John J. Piskorski
- 优先权： JP2008-281399 20081031
- 主分类号： C08K3/28
- IPC分类号： C08K3/28
摘要：
A conditioner, surface treatment method, and metal plating film forming method for a moist method of providing a plating film with strong adhesion towards a surface with low roughness without forming a metal film or performing an adhesion promoter pretreatment using a wet method, when plating a resin substrate containing a blend of resin material and glass material, and the like.
公开/授权文献
- US20100120962A1 Conditioner for electroless plating 公开/授权日：2010-05-13
信息查询
