发明授权
- 专利标题: Semiconductor memory device and method of manufacturing the same
- 专利标题(中): 半导体存储器件及其制造方法
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申请号: US13052177申请日: 2011-03-21
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公开(公告)号: US08796757B2公开(公告)日: 2014-08-05
- 发明人: Tetsuya Kai , Yoshio Ozawa , Ryota Fujitsuka , Yoshitaka Tsunashima
- 申请人: Tetsuya Kai , Yoshio Ozawa , Ryota Fujitsuka , Yoshitaka Tsunashima
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2010-136532 20100615
- 主分类号: H01L29/792
- IPC分类号: H01L29/792
摘要:
According to one embodiment, a semiconductor memory device with memory cells each composed of a vertical transistor, comprises a silicon layer formed into a columnar shape on a silicon substrate, a gate insulating film part in which a tunnel insulating film, a charge storage layer, and a block insulating film are formed to surround the sidewall surface of the silicon layer, and a stacked structure part formed to surround the sidewall surface of the gate insulating film part and in which a plurality of interlayer insulating films and a plurality of control gate electrode layers are stacked alternately. The silicon layer, gate insulating film part, and control gate electrode layer constitute the vertical transistor. The charge storage layer has a region lower in trap level than a region facing the control gate electrode layer between the vertical transistors.
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