发明授权
- 专利标题: Testing of semiconductor chips with microbumps
- 专利标题(中): 用微胶囊测试半导体芯片
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申请号: US13025931申请日: 2011-02-11
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公开(公告)号: US08797057B2公开(公告)日: 2014-08-05
- 发明人: Wei-Cheng Wu , Hsien-Pin Hu , Shang-Yun Hou , Shin-Puu Jeng , Chen-Hua Yu , Chao-Hsiang Yang
- 申请人: Wei-Cheng Wu , Hsien-Pin Hu , Shang-Yun Hou , Shin-Puu Jeng , Chen-Hua Yu , Chao-Hsiang Yang
- 申请人地址: TW
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW
- 代理机构: Lowe Hauptman & Ham, LLP
- 主分类号: G01R31/00
- IPC分类号: G01R31/00
摘要:
Test structures for performing electrical tests of devices under one or more microbumps are provided. Each test structure includes at least one microbump pad and a test pad. The microbump pad is a part of a metal pad connected to an interconnect for a device. A width of the microbump pad is equal to or less than about 50 μm. The test pad is connected to the at least one microbump pad. The test pad has a size large enough to allow circuit probing of the device. The test pad is another part of the metal pad. A width of the test pad is greater than the at least one microbump pad.
公开/授权文献
- US20120206160A1 TESTING OF SEMICONDUCTOR CHIPS WITH MICROBUMPS 公开/授权日:2012-08-16