Methods for forming a wear resistant layer metallurgically bonded to at least a portion of a surface of a metallic substrate may generally comprise positioning hard particles adjacent the surface of the metallic substrate, and infiltrating the hard particles with a metallic binder material to form a wear resistant layer metallurgically bonded to the surface. In certain embodiments of the method, the infiltration temperature may be 50° C. to 100° C. greater than a liquidus temperature of the metallic binder material. The wear resistant layer may be formed on, for example, an exterior surface and/or an interior surface of the metallic substrate. Related wear resistant layers and articles of manufacture are also described.