发明授权
- 专利标题： Substrate for semiconductor package and method of manufacturing thereof
- 专利标题（中）： 半导体封装用基板及其制造方法
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申请号： US13958989申请日： 2013-08-05
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公开(公告)号： US08802496B2公开(公告)日： 2014-08-12
- 发明人: Akinobu Shibuya , Akira Ouchi
- 申请人： Akinobu Shibuya , Akira Ouchi
- 申请人地址： JP Tokyo
- 专利权人： NEC Corporation
- 当前专利权人： NEC Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Sughrue Mion, PLLC
- 优先权： JP2009-168831 20090717
- 主分类号： H01L21/56
- IPC分类号： H01L21/56
摘要：
Disclosed is a substrate for a semiconductor package in which leakage of radiation noise from a gap between a semiconductor element and a mounting substrate can be prevented. The substrate for the semiconductor package includes a coplanar waveguide including a signal and ground electrodes on the mounting substrate, the signal electrode flip-chip connected to the semiconductor element, the ground electrodes arranged on both sides of the signal electrode with intervals therebetween. A step part is formed in the ground electrodes in an outer circumferential part of a mounting region of the semiconductor element, the step part having a larger distance between upper surfaces of the mounting substrate and the ground electrode in the outer circumferential part of the mounting region than such distance in the mounting region, and an insulator for covering the signal electrode in the outer circumferential part of the mounting region is formed.
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