发明授权
- 专利标题： Integrated circuit packaging system with interconnects and method of manufacture thereof
- 专利标题（中）： 具有互连的集成电路封装系统及其制造方法
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申请号： US13069980申请日： 2011-03-23
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公开(公告)号： US08802555B2公开(公告)日： 2014-08-12
- 发明人: Henry Descalzo Bathan , Zigmund Ramirez Camacho , Jairus Legaspi Pisigan , Rachel Layda Abinan
- 申请人： Henry Descalzo Bathan , Zigmund Ramirez Camacho , Jairus Legaspi Pisigan , Rachel Layda Abinan
- 申请人地址： SG Singapore
- 专利权人： STATS ChipPAC Ltd.
- 当前专利权人： STATS ChipPAC Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Ishimaru & Associates LLP
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
A method of manufacture of an integrated circuit packaging system includes: providing a die paddle and a lead adjacent to the die paddle; mounting an integrated circuit, having a bond pad, over the die paddle; forming a bonding interconnect on the bond pad; attaching a circuit end of an internal interconnect to the bonding interconnect, the bonding interconnect between the circuit end and the bond pad; and connecting a lead end of the internal interconnect to the lead.
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