发明授权
- 专利标题： Structure of AC light-emitting diode dies
- 专利标题（中）： 交流发光二极管管芯的结构
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申请号： US12861495申请日： 2010-08-23
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公开(公告)号： US08803166B2公开(公告)日： 2014-08-12
- 发明人: Ming-Te Lin , Fei-Chang Hwang , Chia-Tai Kuo
- 申请人： Ming-Te Lin , Fei-Chang Hwang , Chia-Tai Kuo
- 申请人地址： TW Hsinchu
- 专利权人： Epistar Corporation
- 当前专利权人： Epistar Corporation
- 当前专利权人地址： TW Hsinchu
- 代理机构： Muncy, Geissler, Olds & Lowe, P.C.
- 优先权： TW93126201A 20040831
- 主分类号： H01L33/00
- IPC分类号： H01L33/00
摘要：
An arrangement of light emitting diodes including a first micro-die, a second micro-die, a first bridge, a second bridge and a substrate supporting the first micro-die and the second micro die. The first micro-die includes a first edge having a first end and a second end, a second edge opposite and not parallel to the first edge, a first connecting portion near the first end, and a second connecting portion near the second end.
公开/授权文献
- US20110012137A1 STRUCTURE OF AC LIGHT-EMITTING DIODE DIES 公开/授权日：2011-01-20
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