公开(公告)号：US08053791B2

公开(公告)日：2011-11-08

申请号：US12424109

申请日：2009-04-15

申请人： Ming-Te Lin ,  Fei-Chang Hwang ,  Chia-Tai Kuo

发明人： Ming-Te Lin ,  Fei-Chang Hwang ,  Chia-Tai Kuo

IPC分类号： H01L33/00 ,  H01L33/62

CPC分类号： H01L25/0753 ,  H01L2924/0002 ,  H01L2924/00

摘要： A structure of light-emitting diode (LED) dies having an AC loop (a structure of AC LED dies), which is formed with at least one unit of AC LED micro-dies disposed on a chip. The unit of AC LED micro-dies comprises two LED micro-dies arranged in mutually reverse orientations and connected with each other in parallel, to which an AC power supply may be applied so that the LED unit may continuously emit light in response to a positive-half wave voltage and a negative-half wave voltage in the AC power supply. Since each AC LED micro-die is operated forwardly, the structure of AC LED dies also provides protection from electrical static charge (ESD) and may operate under a high voltage.

摘要翻译： 具有设置在芯片上的至少一个AC LED微管芯单元形成的具有AC环路（AC LED管芯的结构）的发光二极管（LED）裸片的结构。 交流LED微型模具的单元包括两个彼此相反取向并且彼此并联连接的LED微型模具，可以施加交流电源，使得LED单元响应于正向连续地发光 - 交流电源中的一次波电压和一个负半波电压。 由于每个AC LED微型裸片都是正向运行的，所以AC LED芯片的结构也提供了防止静电荷（ESD）的保护，并且可以在高电压下工作。

公开(公告)号：US20080218093A1

公开(公告)日：2008-09-11

申请号：US12149852

申请日：2008-05-09

申请人： Ming-Te Lin ,  Fei-Chang Hwang ,  Chia-Tai Kuo

发明人： Ming-Te Lin ,  Fei-Chang Hwang ,  Chia-Tai Kuo

IPC分类号： H05B37/02 ,  H05B41/24

CPC分类号： H01L25/0753 ,  H01L2924/0002 ,  H01L2924/00

摘要： A structure of light-emitting diode (LED) dies having an AC loop (a structure of AC LED dies), which is formed with at least one unit of AC LED micro-dies disposed on a chip. The unit of AC LED micro-dies comprises two LED micro-dies arranged in mutually reverse orientations and connected with each other in parallel, to which an AC power supply may be applied so that the LED unit may continuously emit light in response to a positive-half wave voltage and a negative-half wave voltage in the AC power supply. Since each AC LED micro-die is operated forwardly, the structure of AC LED dies also provides protection from electrical static charge (ESD) and may operate under a high voltage.

摘要翻译： 具有设置在芯片上的至少一个AC LED微管芯单元形成的具有AC环路（AC LED管芯的结构）的发光二极管（LED）裸片的结构。 交流LED微型模具的单元包括两个彼此相反取向并且彼此并联连接的LED微型模具，可以施加交流电源，使得LED单元响应于正向连续地发光 - 交流电源中的一次波电压和一个负半波电压。 由于每个AC LED微型裸片都是正向运行的，所以AC LED芯片的结构也提供了防止静电荷（ESD）的保护，并且可以在高电压下工作。

公开(公告)号：US08803166B2

公开(公告)日：2014-08-12

申请号：US12861495

申请日：2010-08-23

申请人： Ming-Te Lin ,  Fei-Chang Hwang ,  Chia-Tai Kuo

发明人： Ming-Te Lin ,  Fei-Chang Hwang ,  Chia-Tai Kuo

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  H01L2924/0002 ,  H01L2924/00

摘要： An arrangement of light emitting diodes including a first micro-die, a second micro-die, a first bridge, a second bridge and a substrate supporting the first micro-die and the second micro die. The first micro-die includes a first edge having a first end and a second end, a second edge opposite and not parallel to the first edge, a first connecting portion near the first end, and a second connecting portion near the second end.

摘要翻译： 包括第一微型管芯，第二微型管芯，第一桥接器，第二桥接器和支撑第一微型管芯和第二微型管芯的衬底的发光二极管的布置。 第一微型模头包括具有第一端和第二端的第一边缘，与第一边缘相对且不平行的第二边缘，靠近第一端的第一连接部分和靠近第二端部的第二连接部分。

公开(公告)号：US20110012137A1

公开(公告)日：2011-01-20

申请号：US12861495

申请日：2010-08-23

申请人： Ming-Te LIN ,  Fei-Chang Hwang ,  Chia-Tai Kuo

发明人： Ming-Te LIN ,  Fei-Chang Hwang ,  Chia-Tai Kuo

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  H01L2924/0002 ,  H01L2924/00

摘要： A structure of light-emitting diode (LED) dies having an AC loop (a structure of AC LED dies), which is formed with at least one unit of AC LED micro-dies disposed on a chip. The unit of AC LED micro-dies comprises two LED micro-dies arranged in mutually reverse orientations and connected with each other in parallel, to which an AC power supply may be applied so that the LED unit may continuously emit light in response to a positive-half wave voltage and a negative-half wave voltage in the AC power supply. Since each AC LED micro-die is operated forwardly, the structure of AC LED dies also provides protection from electrical static charge (ESD) and may operate under a high voltage.

摘要翻译： 具有设置在芯片上的至少一个AC LED微管芯单元形成的具有AC环路（AC LED管芯的结构）的发光二极管（LED）裸片的结构。 交流LED微型模具的单元包括两个彼此相反取向并且彼此并联连接的LED微型模具，可以施加交流电源，使得LED单元响应于正向连续地发光 - 交流电源中的一次波电压和一个负半波电压。 由于每个AC LED微型裸片都是正向运行的，所以AC LED芯片的结构也提供了防止静电荷（ESD）的保护，并且可以在高电压下工作。

公开(公告)号：US20090218580A1

公开(公告)日：2009-09-03

申请号：US12424109

申请日：2009-04-15

申请人： Ming-Te LIN ,  Fei-Chang Hwang ,  Chia-Tai Kuo

发明人： Ming-Te LIN ,  Fei-Chang Hwang ,  Chia-Tai Kuo

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  H01L2924/0002 ,  H01L2924/00

摘要： A structure of light-emitting diode (LED) dies having an AC loop (a structure of AC LED dies), which is formed with at least one unit of AC LED micro-dies disposed on a chip. The unit of AC LED micro-dies comprises two LED micro-dies arranged in mutually reverse orientations and connected with each other in parallel, to which an AC power supply may be applied so that the LED unit may continuously emit light in response to a positive-half wave voltage and a negative-half wave voltage in the AC power supply. Since each AC LED micro-die is operated forwardly, the structure of AC LED dies also provides protection from electrical static charge (ESD) and may operate under a high voltage.

摘要翻译： 具有设置在芯片上的至少一个AC LED微管芯单元形成的具有AC环路（AC LED管芯的结构）的发光二极管（LED）裸片的结构。 交流LED微型模具的单元包括两个彼此相反取向并且彼此并联连接的LED微型模具，可以施加交流电源，使得LED单元响应于正向连续地发光 - 交流电源中的一次波电压和一个负半波电压。 由于每个AC LED微型裸片都是正向运行的，所以AC LED芯片的结构也提供了防止静电荷（ESD）的保护，并且可以在高电压下工作。

公开(公告)号：US07531843B2

公开(公告)日：2009-05-12

申请号：US10994361

申请日：2004-11-23

申请人： Ming-Te Lin ,  Fei-Chang Hwang ,  Chia-Tai Kuo

发明人： Ming-Te Lin ,  Fei-Chang Hwang ,  Chia-Tai Kuo

IPC分类号： H01L29/201 ,  H01L29/225

CPC分类号： H01L25/0753 ,  H01L2924/0002 ,  H01L2924/00

摘要： A structure of light-emitting diode (LED) dies having an AC loop (a structure of AC LED dies), which is formed with at least one unit of AC LED micro-dies disposed on a chip. The unit of AC LED micro-dies comprises two LED micro-dies arranged in mutually reverse orientations and connected with each other in parallel, to which an AC power supply may be applied so that the LED unit may continuously emit light in response to a positive-half wave voltage and a negative-half wave voltage in the AC power supply. Since each AC LED micro-die is operated forwardly, the structure of AC LED dies also provides protection from electrical static charge (ESD) and may operate under a high voltage.

摘要翻译： 具有设置在芯片上的至少一个AC LED微管芯单元形成的具有AC环路（AC LED管芯的结构）的发光二极管（LED）裸片的结构。 交流LED微型模具的单元包括两个彼此相反取向并且彼此并联连接的LED微型模具，可以施加交流电源，使得LED单元响应于正向连续地发光 - 交流电源中的一次波电压和一个负半波电压。 由于每个AC LED微型裸片都是正向运行的，所以AC LED芯片的结构也提供了防止静电荷（ESD）的保护，并且可以在高电压下工作。

公开(公告)号：US20060044864A1

公开(公告)日：2006-03-02

申请号：US10994361

申请日：2004-11-23

申请人： Ming-Te Lin ,  Fei-Chang Hwang ,  Chia-Tai Kuo

发明人： Ming-Te Lin ,  Fei-Chang Hwang ,  Chia-Tai Kuo

IPC分类号： G11C11/00

CPC分类号： H01L25/0753 ,  H01L2924/0002 ,  H01L2924/00

摘要： A structure of light-emitting diode (LED) dies having an AC loop (a structure of AC LED dies), which is formed with at least one unit of AC LED micro-dies disposed on a chip. The unit of AC LED micro-dies comprises two LED micro-dies arranged in mutually reverse orientations and connected with each other in parallel, to which an AC power supply may be applied so that the LED unit may continuously emit light in response to a positive-half wave voltage and a negative-half wave voltage in the AC power supply. Since each AC LED micro-die is operated forwardly, the structure of AC LED dies also provides protection from electrical static charge (ESD) and may operate under a high voltage.

公开(公告)号：US07589354B2

公开(公告)日：2009-09-15

申请号：US11194630

申请日：2005-08-02

申请人： Ming-Te Lin ,  Sheng-Pan Huang ,  Chia-Tai Kuo ,  Chiu-Ling Chen ,  Ya-Hui Chiang ,  Ming-Yao Lin

发明人： Ming-Te Lin ,  Sheng-Pan Huang ,  Chia-Tai Kuo ,  Chiu-Ling Chen ,  Ya-Hui Chiang ,  Ming-Yao Lin

IPC分类号： H01L27/15 ,  H01L29/267 ,  H01L31/12 ,  H01L33/00

CPC分类号： H01L33/60 ,  H01L25/0753 ,  H01L33/483 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014

摘要： A light emitting diode (LED) package includes at least one LED chip, a carrier, a light reflection element and at least one outside connection electrode. The LED chip is disposed on the carrier and a conductive line or a flip chip method is used to connect the electrodes of the LED chip to the external connection electrodes. A transparent material is used for fixing the light reflection element and carrier, and forming a lens.

摘要翻译： 发光二极管（LED）封装包括至少一个LED芯片，载体，光反射元件和至少一个外部连接电极。 LED芯片设置在载体上，并且使用导线或倒装芯片方法将LED芯片的电极连接到外部连接电极。 透明材料用于固定光反射元件和载体，并形成透镜。

公开(公告)号：US20060145173A1

公开(公告)日：2006-07-06

申请号：US11194630

申请日：2005-08-02

申请人： Ming-Te Lin ,  Sheng-Pan Huang ,  Chia-Tai Kuo ,  Chiu-Ling Chen ,  Ya-Hui Chiang ,  Ming-Yao Lin

发明人： Ming-Te Lin ,  Sheng-Pan Huang ,  Chia-Tai Kuo ,  Chiu-Ling Chen ,  Ya-Hui Chiang ,  Ming-Yao Lin

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L25/0753 ,  H01L33/483 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014

摘要： A light emitting diode (LED) package includes at least one LED chip, a carrier, a light reflection element and at least one outside connection electrode. The LED chip is disposed on the carrier and a conductive line or a flip chip method is used to connect the electrodes of the LED chip to the external connection electrodes. A transparent material is used for fixing the light reflection element and carrier, and forming a lens.

公开(公告)号：US08368099B2

公开(公告)日：2013-02-05

申请号：US12182218

申请日：2008-07-30

申请人： Chien-Chun Lu ,  Chia-Tai Kuo ,  Chen-Peng Hsu ,  Hung-Lieh Hu ,  Chien-Jen Sun

发明人： Chien-Chun Lu ,  Chia-Tai Kuo ,  Chen-Peng Hsu ,  Hung-Lieh Hu ,  Chien-Jen Sun

IPC分类号： H01L33/00

CPC分类号： H01L33/505 ,  H01L33/508 ,  H01L33/60 ,  H01L2924/0002 ,  H05B33/10 ,  H01L2924/00

摘要： A light emitting device and a fabricating method thereof are described. The light emitting device includes a substrate, a light emitting chip, a tubular structure, and a fluorescent conversion layer. The tubular structure is formed on a surface of the substrate. The light emitting chip is disposed on the surface of the substrate and is surrounded by the tubular structure. The fluorescent conversion layer is disposed in the tubular structure and covers the light emitting chip. A ratio of a maximal vertical thickness and a maximal horizontal thickness of the fluorescent conversion layer at the light emitting chip is between 0.1 and 10. A distance for the light ray to pass through the fluorescent conversion layer is controlled by using the tubular structure, so as to solve a problem of the conventional art that fluorescent powder coating package technique results in non-uniform color temperature of the emitted light.

摘要翻译： 描述了发光器件及其制造方法。 发光器件包括衬底，发光芯片，管状结构和荧光转换层。 管状结构形成在基板的表面上。 发光芯片设置在基板的表面上并被管状结构包围。 荧光转换层设置在管状结构中并覆盖发光芯片。 发光芯片上的荧光转换层的最大垂直厚度与最大水平厚度的比率为0.1至10.通过使用管状结构来控制光线穿过荧光转换层的距离，因此 为了解决现有技术的问题，荧光粉末涂布包装技术导致发出的光的不均匀的色温。